Semiconductor device manufacturing method and substrate processing apparatus
View Patent ↗Provided is a semiconductor device manufacturing method of forming a film of less than one atomic layer on a substrate. The method includes (a) supplying a source gas into a processing chamber accommodating the substrate to adsorb the source gas on the substrate; (b) supplying a reactive gas different from the source gas into the processing chamber to cause a reaction of the reactive gas with the source gas adsorbed on the substrate before the source gas is saturatively adsorbed on the substrate; (c) removing an inner atmosphere of the processing chamber; and (d) supplying a modifying gas into the processing chamber to modify the source gas adsorbed on the substrate.
1. A semiconductor device manufacturing method of forming a film of less than one atomic layer on a substrate, the method comprising:
(a) supplying a source gas into a processing chamber accommodating the substrate to adsorb the source gas on the substrate;
(b) supplying a reaction inhibiting material into the processing chamber before the source gas is saturatively adsorbed on the substrate so as to hinder an absorption of the source gas adsorbed on the substrate;
(c) removing an inner atmosphere of the processing chamber; and
(d) supplying a modifying gas into the processing chamber to modify the source gas adsorbed on the substrate.
2. The method according to claim 1 , wherein the reaction inhibiting material comprises a chlorine (Cl)-containing gas, and the source gas comprises a metal source gas and the modifying gas comprises at least one selected from the group consisting of an oxygen (O)-containing gas and a nitrogen (N)-containing gas.
3. The method according to claim 1 , wherein the step (d) comprises activating the modifying gas using at least one selected from the group consisting of heat, light and plasma.
4. The method according to claim 1 , wherein the method is performed by setting a temperature of substrate to range from 200° C. to 550° C.
5. The method according to claim 4 , wherein the method is performed by setting a temperature of the substrate to range from 300° C. to 450° C.
6. The method according to claim 1 , wherein the method is performed by setting a temperature of the substrate to be equal to or lower than a self-decomposition temperature of the source gas.
7. The method according to claim 1 , wherein the film of less than one atomic layer is formed on the substrate by utilizing a point of inflection of a growth rate of the film.
8. The method of claim 1 , wherein the step (d) comprises supplying the modifying gas activated by at least one selected from the group consisting of heat, light and plasma to the substrate.
9. The method of claim 1 , wherein the steps (a) through (d) are repeated.
10. The method of claim 1 , wherein the step (b) is started during the step (a).
11. The method of claim 1 , wherein the step (b) overlaps the step (a) in at least some periods.
12. A semiconductor device manufacturing method of forming a film of less than one atomic layer on a substrate, the method comprising:
(a) supplying a source gas into a processing chamber accommodating the substrate to adsorb the source gas on the substrate;
(b) supplying a reaction inhibiting material into the processing chamber before the source gas is saturatively adsorbed on the substrate so as to hinder an absorption of the source gas adsorbed on the substrate;
(c) removing an inner atmosphere of the processing chamber;
(d) supplying a modifying gas into the processing chamber to modify the source gas adsorbed on the substrate;
(e) removing the inner atmosphere of the processing chamber; and
(f) supplying the modifying gas into the processing chamber while activating the modifying gas to modify the source gas adsorbed on the substrate,
wherein the steps (a) through (f) are sequentially performed.
13. The method according to claim 12 , wherein the film of less than one atomic layer is formed on the substrate by utilizing a point of inflection of a growth rate of the film.
14. A substrate processing apparatus comprising:
a processing chamber configured to accommodate a substrate;
a source gas supply system configured to supply a source gas into the processing chamber;
a reaction inhibiting material supply system configured to supply a reaction inhibiting material into the processing chamber;
a modifying gas supply system configured to supply a modifying gas into the processing chamber;
an exhaust system configured to exhaust an inside of the processing chamber; and
a controller configured to control the source gas supply system, the reaction inhibiting material supply system, the modifying gas supply system and the exhaust system such that a film of less than one atomic layer is formed on the substrate by performing a process including: (a) supplying the source gas into the processing chamber accommodating the substrate to adsorb the source gas on the substrate; (b) supplying the reaction inhibiting material into the processing chamber before the source gas is saturatively adsorbed on the substrate so as to hinder an adsorption of the source gas on the substrate; (c) removing an inner atmosphere of the processing chamber; and (d) supplying the modifying gas into the processing chamber to modify the source gas adsorbed on the substrate.