IP Library › Granted Patent US 10,331,247
Granted Patent B2
US 10,331,247 · App. 14/877,436 · Granted Jun 25, 2019

Functional panel, device, and data processor

Inventors: Yasuhiro Jinbo (Kanagawa, JP); Akio Endo (Kanagawa, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
G06F3/0412G06F1/163G06F1/1616G06F1/1626G06F1/1641G06F1/1652G06F1/1681G06F3/044G06F2203/04102G06F2203/04103
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Quick Facts
Patent No.
US 10,331,247
App. No.
14/877,436
Granted
Jun 25, 2019
Kind
B2
Abstract

A novel functional panel, a novel device, or a novel data processor is provided. A structure in which a first plane, a second plane that is opposite the first plane, and a neutral plane between the first plane and the second plane are provided and a portion of a functional layer having a thickness greater than or equal to half of the thickness of the functional layer is in a region between the first plane and the neutral plane was conceived.

Claims (39)

1. A panel comprising:

a first support having a first surface;

a second support having a second surface;

a neutral plane; and

a functional layer between the first support and the second support,

wherein the first support and the second support overlap with each other with the first surface and the second surface facing outward;

wherein the second support comprises a first member and a second member, the first member having a higher rigidity than the second member,

wherein the first member is provided between the second surface and the functional layer in a first region,

wherein the second member is provided between the first member and the functional layer in the first region, and provided between the second surface and the functional layer and between the second surface and the first support in a second region,

wherein a distance between the neutral plane and the second surface in the first region is shorter than in the second region, and

wherein the panel comprises the first region bendable with the first surface inside and the second region adjacent to the first region.

2. The panel according to claim 1 , wherein the functional layer includes a display element.

3. The panel according to claim 1 , wherein the functional layer includes a sensor element.

4. A device comprising:

the panel according to claim 1 ; and

a frame,

wherein the frame is configured to support the panel, and

wherein the frame is configured to put the panel into a bent state with the first surface inside.

5. A device comprising:

the panel according to claim 1 ; and

a frame,

wherein the frame is configured to support the panel,

wherein the frame is configured to put the panel into a bent state with the first surface inside so that the panel has a fold having a curvature radius greater than or equal

to a first curvature radius, and

wherein the frame is configured to put the panel into a bent state with the second surface inside so that the panel has a fold having a curvature radius greater than the first curvature radius.

6. A device comprising:

the panel according to claim 1 ; and

a frame,

wherein the frame is configured to support the panel, and

wherein the frame is configured to put the panel into a bent state with the first surface inside so that the panel has a fold in the first region.

7. A device comprising:

the panel according to claim 1 ; and

a frame,

wherein the frame is configured to support the panel,

wherein the frame is configured to put the panel into a bent state with the first surface inside so that the panel has a fold having a curvature radius greater than or equal to a first curvature radius in the first region, and

wherein the frame is configured to put the panel into a bent state with the second surface inside so that the panel has a fold having a curvature radius greater than the first curvature radius in the first region.

8. A data processor comprising:

the device according to claim 4 ; and

at least one of a microphone, an antenna, a battery, an operation switch, and a housing.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 7, 2015
From: JINBO, YASUHIRO; ENDO, AKIO
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD
Reel/Frame 036751/0608 →
Priority Claims (1)
JP 2014-208884 · Oct 10, 2014 · national
Continuity (1)
Related Publication 20160103539A1 · Apr 14, 2016
Cited By (3)
US 12,267,968 US 12,272,271 US 12,603,948