IP Library Granted Patent US 9,911,600
Granted Patent B2
US 9,911,600 · App. 14/878,136 · Granted Mar 6, 2018

Fabrication of semiconductor device using alternating high and low temperature layers

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Quick Facts
Patent No.
US 9,911,600
App. No.
14/878,136
Granted
Mar 6, 2018
Kind
B2
Abstract

A method for fabricating a III-nitride semiconductor body that includes high temperature and low temperature growth steps.

Claims (15)

1. A method of fabricating a semiconductor device, said method comprising:

providing a silicon substrate; and

growing a III-nitride body over a major surface of said substrate to a final thickness over a growth period of time,

wherein growing said III-nitride body comprises growing at least two AlN layers including a first AlN layer and a second AlN layer grown directly on said first AlN layer, and growing a superlattice over said second AlN layer, said first AlN layer grown during a period of low temperature growth at a first temperature, said second AlN layer grown on said first AlN layer during a period of high temperature growth at a second temperature, and said superlattice grown at a constant temperature,

wherein said first temperature is lower than said second temperature.

2. The method of claim 1 , wherein a number of layers grown at said second temperature is equal to a number of layers grown at said first temperature.

3. The method of claim 1 , further comprising forming a buffer layer over said III-nitride body.

4. The method of claim 3 , further comprising forming an active layer over said buffer layer, said active layer providing an active region for fabricating a power FET.

5. The method of claim 1 , wherein said second temperature is constant over said growth period of time.

6. The method of claim 1 , wherein said first temperature is constant over said growth period of time.

7. The method of claim 1 , wherein said period of high temperature growth is varied.

8. The method of claim 1 , wherein said period of low temperature growth is varied.

9. The method of claim 1 , wherein said period of high temperature growth and said period of low temperature growth are varied.

10. The method of claim 1 , wherein said period of high temperature growth is equal to said period of low temperature growth.

11. The method of claim 1 , wherein said period of high temperature growth is different than said period of low temperature growth.

Assignments (3)
MERGER AND CHANGE OF NAME Recorded Apr 13, 2016
From: INFINEON TECHNOLOGIES NORTH AMERICA CORP.; INTERNATIONAL RECTIFIER CORPORATION; INTERNATIONAL RECTIFIER CORPORATION
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 038463/0859 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 25, 2016
From: BRIDGER, PAUL; BEACH, ROBERT
To: INTERNATIONAL RECTIFIER CORPORATION
Reel/Frame 037833/0516 →
MERGER AND CHANGE OF NAME Recorded Feb 25, 2016
From: INTERNATIONAL RECTIFIER CORPORATION; INFINEON TECHNOLOGIES AMERICAS CORP.
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 037834/0031 →