Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes
A retaining ring for a polishing process is disclosed. The retaining ring includes a body comprising an upper portion and a lower portion, and a sacrificial surface disposed on the lower portion, the sacrificial surface comprising a negative tapered surface having a taper height that is about 0.0003 inches to about 0.00015 inches.
1. A fixture for forming a sacrificial surface on a retaining ring, the fixture comprising:
a fixture plate sized to substantially match an outside diameter of the retaining ring; and
a clamp device adapted to provide a lateral load to one of an inside diameter sidewall or an outer diameter sidewall of a lower portion of the retaining ring.
2. The fixture of claim 1 , wherein the clamp device is an external clamp device adapted to surround the outer diameter sidewall of the lower portion of the retaining ring.
3. The fixture of claim 2 , wherein the clamp device comprises one or more annular clamp rings.
4. The fixture of claim 2 , wherein the clamp device comprises an outer ring that fits tightly with the outer diameter sidewall of a lower portion of the retaining ring.
5. The fixture of claim 4 , wherein the outer ring is coupled to one or more annular clamp rings by a plurality of fasteners.
6. The fixture of claim 1 , wherein the clamp device is an internal clamp device adapted to surround the inside diameter sidewall of the lower portion of the retaining ring.
7. The fixture of claim 6 , wherein the clamp device comprises a mandrel that snugly fits within the inside diameter sidewall of the retaining ring.
8. The fixture of claim 7 , further comprising a swage adapter disposed between the mandrel and the fixture plate.
9. The fixture of claim 7 , wherein an outer peripheral surface of the mandrel includes an angle that is less than 90 degrees.