Controlled spalling utilizing vaporizable release layers

1. A method, comprising the steps of:

providing a base substrate;

depositing a stressor layer and a vaporizable release layer on the base substrate, wherein the vaporizable release layer comprises norbornene materials which vaporize at a temperature ranging from about 200 degrees Celsius to about 300 degrees Celsius;

forming a flexible support layer on at least one of the stressor layer and the vaporizable release layer;

spalling an upper portion of the base substrate;

securing the spalled upper portion of the base substrate to a handle substrate; and

vaporizing the vaporizable release layer.

2. The method of claim 1 , wherein the vaporizable release layer is positioned between the stressor layer and the flexible support layer.

3. The method of claim 1 , wherein the vaporizable release layer is positioned between the stressor layer and the base substrate.

4. The method of claim 1 , wherein the vaporizable release layer is patterned to define edges of the stressor layer and is positioned between the stressor layer and the base substrate.

5. The method of claim 1 , wherein the flexible support layer comprises at least one of a flexible support tape and a tape adhesive.

6. The method of claim 1 , wherein the vaporizable release layer is applied via a standard spin coat process.

7. A method, comprising the steps of:

providing a base substrate;

depositing a stressor layer and a vaporizable release layer on the base substrate;

forming a flexible support layer on at least one of the stressor layer and the vaporizable release layer, wherein the flexible support layer comprises at least one of a flexible support tape and a tape adhesive, and wherein the vaporizable release layer is pre-coated onto the flexible support layer;

spalling an upper portion of the base substrate;

securing the spalled upper portion of the base substrate to a handle substrate; and

vaporizing the vaporizable release layer.

8. An apparatus, comprising:

a base substrate;

a stressor layer and a vaporizable release layer formed on the base substrate, wherein the vaporizable release layer comprises norbornene materials which vaporize at a temperature ranging from about 200 degrees Celsius to about 300 degrees Celsius; and

a flexible support layer formed on at least one of the stressor layer and the vaporizable release layer;

wherein the apparatus is configured to enable an upper portion of the base substrate to be spalled and secured to a handle substrate, and the vaporizable release layer to be vaporized.

9. The apparatus of claim 8 , wherein the vaporizable release layer is positioned between the stressor layer and the flexible support layer.

10. The apparatus of claim 8 , wherein the vaporizable release layer is positioned between the stressor layer and the base substrate.

11. The apparatus of claim 8 , wherein the vaporizable release layer is patterned to define edges of the stressor layer and is positioned between the stressor layer and the base substrate.

12. The apparatus of claim 8 , wherein the flexible support layer comprises at least one of a flexible support tape and a tape adhesive.

13. The apparatus of claim 12 , wherein the vaporizable release layer is pre-coated onto the flexible support layer.

14. The apparatus of claim 8 , wherein the vaporizable release layer is applied via a standard spin coat process.

15. A method for spalling a base substrate, comprising the steps of:

providing the base substrate;

depositing a vaporizable release layer on the base substrate;

depositing a stressor layer on the vaporizable release layer;

forming a flexible support layer on the stressor layer, wherein the flexible support layer comprises at least one of a flexible support tape and a tape adhesive, and wherein the vaporizable release layer is pre-coated onto the flexible support layer;

spalling an upper portion of the base substrate;

securing the spalled upper portion of the base substrate to a handle substrate; and

vaporizing the vaporizable release layer.

16. The method of claim 15 , wherein the vaporizable release layer is patterned to define edges of the stressor layer.