Laterally diffused metal oxide semiconductor device and manufacturing method therefor
Provided is a manufacturing method for a laterally diffused metal oxide semiconductor device, comprising the following steps: growing an oxide layer on a substrate of a wafer (S 210 ); coating a photoresist on the surface of the wafer (S 220 ); performing photoetching by using a first photoetching mask, and exposing a first implantation window after development (S 230 ); performing ion implantation via the first implantation window to form a drift region in the substrate (S 240 ); coating one layer of photoresist on the surface of the wafer again after removing the photoresist (S 250 ); performing photoetching by using the photoetching mask of the oxide layer of the drift region (S 260 ); and etching the oxide layer to form the oxide layer of the drift region (S 270 ). Further provided is a laterally diffused metal oxide semiconductor device.
1. A method of manufacturing a laterally diffused metal oxide semiconductor device, comprising the following steps:
growing an oxide layer on a substrate of a wafer having a first doping type;
coating a photoresist on a surface of the wafer;
performing lithography by using a first photomask, and exposing a first implantation window after developing;
performing ion implantation via the first implantation window, and forming a drift region in the substrate, wherein the ion implantation is performed by implanting impurity ion having a second doping type;
coating a photoresist on the surface of the wafer again after removing the photoresist;
performing lithography by using a drift region oxide layer photomask; and
etching the oxide layer to form a drift region oxide layer, wherein conductivity types of the first doping type and the second doping type are contrary.
2. The method of manufacturing the laterally diffused metal oxide semiconductor device according to claim 1 , wherein prior to growing the oxide layer on the substrate of the wafer having the first doping type, the method further comprises: forming a well region having the first doping type in the substrate, the drift region is formed in the well region.
3. The method of manufacturing the laterally diffused metal oxide semiconductor device according to claim 2 , wherein the first doping type is p-type, and the second doping type is n-type.
4. The method of manufacturing the laterally diffused metal oxide semiconductor device according to claim 1 , wherein after etching the oxide layer to form the drift region oxide layer, the method further comprises: depositing polysilicon and etching the polysilicon to form a gate, a part of the gate covers the drift region oxide layer.
5. The method of manufacturing the laterally diffused metal oxide semiconductor device according to claim 1 , wherein implantation energy of the ion implantation ranges from 110 keV to 130 keV.
6. The method of manufacturing the laterally diffused metal oxide semiconductor device according to claim 1 , wherein the performing ion implantation via the first implantation window, and forming the drift region in the substrate comprises: forming the drift region and a drain during one time ion implantation, and implanted doping ion concentrations of the drift region and the drain are the same after the ion implantation is completed.
7. The method of manufacturing the laterally diffused metal oxide semiconductor device according to claim 6 , wherein forming the drift region and a drain comprised forming the drain inside the drift region.
8. The method of manufacturing the laterally diffused metal oxide semiconductor device according to claim 1 , wherein after performing ion implantation via the first implantation window, and forming the drift region in the substrate, the method further comprises: performing lithography by using a drain photomask, and performing ion implantation to form a drain in the substrate.
9. A laterally diffused metal oxide semiconductor device, comprising:
a substrate having a first doping type;
a well region having the first doping type located in the substrate;
a body region having the first doping type located in the well region;
a source having the first doping type located in the well region;
a drift region having a second doping type located in the well region;
a drain having the second doping type located in the well region;
a field oxide region located on a surface of the well region and between the body region and the source;
a drift region oxide layer located on a surface of the drift region; and
a gate located on the well region;
wherein a part of the gate covers the drift region oxide layer, the drift region and the drain are integrally formed, doping ion concentrations of the drift region and the drain are the same;
conductivity types of the first doping type and the second doping type are contrary.
10. The laterally diffused metal oxide semiconductor device according to claim 9 , wherein the first doping type is p-type, and the second doping type is n-type.