Antenna module and method for mounting the same
An antenna module of the present invention is an antenna module 1 including a waveguide slot antenna ( 1 A), a microstripline ( 1 B), and an RFIC ( 16 ), the RFIC ( 16 ) being disposed to overlap a waveguide ( 123, 126 ) of the waveguide slot antenna ( 1 A) as viewed in a stacking direction of layers. This provides an antenna module which can be mounted in a smaller area than a conventional antenna module.
1. An antenna module comprising:
a waveguide slot antenna including a first conductor layer and a second conductor layer facing each other via a first dielectric layer, the first conductor layer having an opening serving as a slot;
a microstripline including the second conductor layer and a third conductor layer facing each other via a second dielectric layer; and
a radio frequency integrated circuit being connected to the third conductor layer,
the radio frequency integrated circuit being disposed so as to overlap a waveguide in the waveguide slot antenna as viewed in a stacking direction of the layers,
the third conductor layer being a conductor pattern including a signal line having (i) one end which is connected to the radio frequency integrated circuit and (ii) the other end which is connected to a TE mode excitation structure in the waveguide slot antenna, and
the signal line extending from the other end toward a center of the waveguide,
wherein the microstripline is planar.
2. The antenna module as set forth in claim 1 , wherein:
the waveguide slot antenna includes, as the TE mode excitation structure, a through-hole (i) extending from an upper surface of the first dielectric layer to a lower surface of the first dielectric layer and (ii) having an inner wall to which conductor plating is applied, the through-hole being insulated from the first and second conductor layers due to respective openings of the first and second conductor layers, and the through-hole being electrically conducted with the other end of the signal line.
3. The antenna module as set forth in claim 1 , wherein:
the third conductor layer is the conductor pattern including the signal line having the one end which is connected to the radio frequency integrated circuit; and
the waveguide slot antenna includes, as the TE mode excitation structure, a non-through-hole (i) extending from an upper surface of the first dielectric layer to an inside of the first dielectric layer and (ii) having an inner wall to which conductor plating is applied, the non-through-hole being electrically insulated from the second conductor layer due to an opening of the second conductor layer, and the non-through-hole being electrically conducted with the other end of the signal line.
4. The antenna module as set forth in claim 1 , wherein the waveguide slot antenna is a post wall waveguide antenna.
5. A method for mounting, on a printed circuit board, an antenna module as set forth in claim 1 , comprising the step of:
bump-connecting the antenna module to the printed circuit board via a solder bump,
the solder bump via which the antenna module is bump-connected to the printed circuit board having a height greater than a sum of (i) a thickness of the radio frequency integrated circuit and (ii) a height of a solder bump via which the radio frequency integrated circuit is bump-connected to the third conductor layer.
6. The antenna module as set forth in claim 1 , wherein the second conductor layer is a ground plane of the microstripline.