IP Library Granted Patent US 9,658,063
Granted Patent B2
US 9,658,063 · App. 14/897,609 · Granted May 23, 2017

Method and device for line pattern shape evaluation

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Quick Facts
Patent No.
US 9,658,063
App. No.
14/897,609
Granted
May 23, 2017
Kind
B2
Abstract

The present invention pertains to a method and device for quantitatively evaluating the degree and characteristics of wiggling, which is a phenomenon that occurs in electronic device fabrication processes and consists of the deformation in the same shape of the left and right edges of fine line patterns, and takes advantage of the fact that this wiggling is included in measured values for line edge variation but not line width variation by acquiring the differences between these values. Further, the present invention is configured so as to calculate line center positions and use the distribution of the deviation from the average line center position as an indicator. Additionally, the present invention is configured to quantify wiggling characteristics by outputting a coefficient of wiggling correlation between lines or a wiggling component synchronized between lines as an indicator.

Claims (74)

1. A method of evaluating a shape of a line pattern of a sample in an image obtained by irradiating the sample with a charged particle beam, comprising:

an extraction process of extracting edge points at both sides of a contour of the line pattern;

a fluctuation amount calculation process of calculating a fluctuation amount of the edge points at the both sides, in a direction of extending the line pattern;

a width fluctuation amount calculation process of calculating a fluctuation amount of widths between the edge points at the both sides, in the direction of extending the line pattern; and

a difference calculation process of calculating a difference between the fluctuation amount of the edge points at the both sides and the fluctuation amount of the widths between the edge points at the both sides.

2. The method according to claim 1 , further comprising:

a region setting process of setting a specified region including the edge points at the both sides; wherein

the difference calculation process is performed based on an average value of a plurality of edge points or a dispersion value in the specified region.

3. The method according to claim 1 , further comprising:

a spectrum calculation process of calculating a first and a second power spectrums that are fluctuation in a direction along the both sides of the contour of the line pattern, wherein

the difference calculation process is performed based on the first and the second power spectrums.

4. A method of evaluating a shape of a line pattern of a sample in an image obtained by irradiating the sample with a charged particle beam, comprising:

an extraction process of extracting edge points at both sides of a contour of the line pattern;

a center point calculation process of calculating a center point of the line pattern based on the edge points at the both sides;

an execution process of executing the extraction process and the center point calculation process a plurality of times, in a direction of extending the line pattern; and

a dispersion value calculation process of calculating a dispersion value of the center points of a plurality of the line patterns calculated in the execution process.

5. The method according to claim 4 , further comprising:

an overlapping deviation calculation process of calculating a dispersion value of errors in overlapping deviation measurement, based on a dispersion value of variation of pattern overlapping deviation amount measurement obtained by a charged particle beam device and the above mentioned dispersion value of the center points.

6. A method of evaluating a shape of a line pattern of a sample in an image obtained by irradiating the sample with a charged particle beam, comprising:

an extraction process of extracting edge points of a contour of the line pattern;

a fluctuation amount calculation process of calculating a fluctuation amount of the edge points in a direction along the contour of the line pattern, in a direction of extending the line pattern; and

a similarity calculation process of calculating similarity between the fluctuation amount and a fluctuation amount of edge points of a line pattern adjacent to the above mentioned line pattern.

7. The method according to claim 6 , wherein

in the similarity calculation process, similarity between a fluctuation amount of the edge points at a first side of the line pattern and a fluctuation amount of the edge points at a second side different from the first side of the line pattern adjacent to the line pattern, is calculated.

8. The method according to claim 6 , further comprising:

a center point calculation process of calculating a center point of the line pattern based on the edge points at the both sides;

an execution process of executing the extraction process and the center point calculation process a plurality of times, in the direction of extending the line pattern;

an adjacent pattern execution process of executing the execution process also in other adjacent line patterns; wherein

in the similarity calculation process, similarity between a fluctuation of the center positions of the line patterns obtained by the execution process and a fluctuation of the center positions of the other adjacent line patterns obtained by the adjacent pattern execution process, is calculated.

9. A method of evaluating a shape of a line pattern of a sample in an image obtained by irradiating the sample with a charged particle beam, comprising:

an extraction process of extracting edge points at both sides of a contour of the line pattern;

a center point calculation process of calculating a center point of the line pattern based on the edge points at the both sides;

an execution process of calculating a fluctuation amount of the center points of the line patterns by several times of execution of the extraction process and the center point calculation process, in a direction of extending the line pattern;

an adjacent pattern execution process of executing the execution process also in other adjacent line patterns; and

a similarity fluctuation amount calculation process of calculating a fluctuation amount that is similar in the line patterns and the other line patterns, based on the fluctuation amount of the center points of the line patterns and the fluctuation amount of the center points of the other line patterns.

10. A device of line pattern shape evaluation comprising:

an image recording unit in which an image obtained by irradiating a sample with a charged particle beam is recorded;

an extraction unit that extracts edge points at both sides of a contour of a line pattern in the image recorded in the image recording unit;

a fluctuation amount calculation unit that calculates a fluctuation amount of the edge points at the both sides, in a direction of extending the line pattern;

a width fluctuation amount calculation unit that calculates a fluctuation amount of widths between the edge points at the both sides, in the direction of extending the line pattern; and

a difference calculation unit that calculates a difference between the fluctuation amount of the edge points at the both sides and the fluctuation amount of the widths between the edge points at the both sides.

11. The device according to claim 10 , further comprising

a region setting unit that sets a specified region including the edge points at the both sides, wherein

the difference calculation unit executes a calculation, based on the average value of the edge points or a dispersion value in the specified region.

12. The device according to claim 10 , further comprising

a spectrum calculation unit that calculates a first and a second power spectrums that are fluctuation in a direction along the both sides of the contour of the line pattern, wherein

the difference calculation unit executes a calculation, based on the first and the second power spectrums.

13. A device of line pattern shape evaluation comprising:

an image recording unit in which an image obtained by irradiating a sample with a charged particle beam is recorded;

an extraction unit that extracts edge points at both sides of a contour of a line pattern in the image recorded in the image recording unit;

a center point calculation unit that calculates a center point of the line pattern based on the edge points at the both sides;

an execution unit that executes the processing by the extraction unit and the center point calculation unit a plurality of times, in a direction of extending the line pattern; and

a dispersion value calculation unit that calculates a dispersion value of the center points of the line patterns calculated by the execution unit.

14. The device according to claim 13 , further comprising

an overlapping deviation calculation unit that calculates a dispersion value of errors in overlapping deviation measurement, base on a dispersion value of variation of the pattern overlapping deviation amount measurement obtained by a charged particle beam device and the dispersion value.

15. A device of line pattern shape evaluation comprising:

an image recording unit in which an image obtained by irradiating a sample with charged particle beam is recorded;

an extraction unit that extracts edge points at both sides of a contour of a line pattern in the image recorded in the image recording unit;

a fluctuation amount calculation unit that calculates a fluctuation amount of the edge points in a direction along the contour of the line pattern, in a direction of extending the line pattern; and

a similarity calculation unit that calculates similarity between the fluctuation amount and a fluctuation amount of the edge points in a line pattern adjacent to the line pattern.

16. The device according to claim 15 , wherein

the similarity calculation unit calculates similarity between the fluctuation amount of the edge points at a first side of the line pattern and the fluctuation amount of the edge points at a second side different from the first side of the line pattern adjacent to the line pattern.

17. The device according to claim 15 , further comprising

a center point calculation unit that calculates a center point of the line pattern based on the edge points at the both sides;

an execution unit that executes the processing by the extraction unit and the center point calculation unit a plurality of times, in the direction of extending the line pattern; and

an adjacent pattern execution unit that executes the processing by the execution unit also in other adjacent line patterns; wherein

the similarity calculation unit that calculates similarity between the fluctuation of the center positions of the line patterns obtained by the execution unit and the fluctuation of the center positions of the other adjacent line patterns obtained by the adjacent pattern execution unit.

18. A device of line pattern shape evaluation comprising:

an image recording unit in which an image obtained by irradiating a sample with a charged particle beam is recorded;

an extraction unit that extracts edge points at both sides of a contour of a line pattern in the image recorded in the image recording unit;

a center point calculation unit that calculates a center point of the line pattern based on the edge points at the both sides;

an execution unit that calculates a fluctuation amount of the center points of the line patterns by several times of processing by the extraction unit and the center point calculation unit, in a direction of extending the line pattern;

an adjacent pattern execution unit that executes the processing by the execution unit also in other adjacent line patterns; and

similarity fluctuation amount calculation unit that calculates a fluctuation amount at a position where the line pattern is similar to the other line pattern, based on the fluctuation amount of the center points of the line patterns and the fluctuation amount of the center points of the other line patterns.

Assignments (3)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →
CORRECTIVE ASSIGNMENT TO CORRECT THE THE INVENTOR'S NAME AND ASSIGNEE'S NAME AND ADDRESS PREVIOUSLY RECORDED ON REEL 039753 FRAME 0601. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNOR'S INTEREST. Recorded Feb 3, 2017
From: YAMAGUCHI, ATSUKO; KAWADA, HIROKI
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 041623/0361 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 15, 2016
From: KIMURA, YOSHINOBU; TSUNO, NATSUKI; OHTA, HIROYA; YAMADA, RENICHI; OHNO, TOSHIYUKI; MORI, YUKI
To: HITACHI, LTD.
Reel/Frame 039753/0601 →