Semiconductor device and manufacturing method for same, crystal, and manufacturing method for same
A semiconductor device or a crystal that suppresses phase transition of a corundum structured oxide crystal at high temperatures is provided. According to the present invention, a semiconductor device or a crystal structure is provided, including a corundum structured oxide crystal containing one or both of indium atoms and gallium atoms, wherein the oxide crystal contains aluminum atoms at least in interstices between lattice points of a crystal lattice.
1. A semiconductor device or a crystal structure, comprising a corundum structured oxide crystal containing one or both of indium atoms and gallium atoms, wherein
the oxide crystal contains aluminum atoms at least in interstices between lattice points of a crystal lattice.
2. The semiconductor device or crystal structure of claim 1 , wherein a composition of the atoms at the lattice points forming the corundum structure of the oxide crystal is In X Al Y Ga Z O 3 (0<X≤2, 0≤Y≤2, 0≤Z≤2, X+Y+Z=1.5 to 2.5; or 0≤X≤2, 0≤Y≤2, 0<Z≤2, X+Y+Z=1.5 to 2.5).
3. The semiconductor device or crystal structure of claim 2 , wherein 0<Y.
4. The semiconductor device or crystal structure of claim 1 , wherein a group III nitride crystal layer is provided directly or via a buffer layer on the oxide crystal.
5. A semiconductor device or a crystal structure, comprising a corundum structured oxide crystal containing one or both of indium atoms and gallium atoms, wherein the oxide crystal contains aluminum atoms, and
an atomic ratio of the aluminum atoms present at the lattice points in the crystal lattice of the oxide crystal to a total of the indium atoms and the gallium atoms in the oxide crystal is more than 0 and is 2.9% or less.
6. The semiconductor device or crystal structure of claim 5 , wherein a composition of the atoms at the lattice points forming the corundum structure of the oxide crystal is In X Al Y Ga Z O 3 (0<X≤2, 0≤Y≤2, 0≤Z≤2, X+Y+Z=1.5 to 2.5; or 0≤X≤2, 0≤Y≤2, 0<Z≤2, X+Y+Z=1.5 to 2.5).
7. The semiconductor device or crystal structure of claim 6 , wherein 0<Y.
8. The semiconductor device or crystal structure of claim 5 , wherein a group III nitride crystal layer is provided directly or via a buffer layer on the oxide crystal.
9. A semiconductor device or a crystal structure, comprising a corundum structured oxide crystal containing one or both of indium atoms and gallium atoms, wherein the oxide crystal contains aluminum atoms, and
a c-axis length when the oxide crystal contains the aluminum atoms is longer than a c-axis length when the oxide crystal contains no aluminum atom.
10. The semiconductor device or crystal structure of claim 9 , wherein a composition of the atoms at the lattice points forming the corundum structure of the oxide crystal is In X Al Y Ga Z O 3 (0<X≤2, 0≤Y≤2, 0≤Z≤2, X+Y+Z=1.5 to 2.5; or 0≤X≤2, 0≤Y≤2, 0<Z≤2, X+Y+Z=1.5 to 2.5).
11. The semiconductor device or crystal structure of claim 10 , wherein 0<Y.
12. The semiconductor device or crystal structure of claim 9 , wherein a group III nitride crystal layer is provided directly or via a buffer layer on the oxide crystal.
13. A semiconductor device or a crystal structure, comprising a corundum structured oxide crystal containing one or both of indium atoms and gallium atoms, wherein the oxide crystal contains aluminum atoms, and
a c-axis length when the oxide crystal contains the aluminum atoms is 0.9991 times or more as long as a c-axis length when the oxide crystal contains no aluminum atom.
14. The semiconductor device or crystal structure of claim 13 , wherein a composition of the atoms at the lattice points forming the corundum structure of the oxide crystal is In X Al Y Ga Z O 3 (0<X≤2, 0≤Y≤2, 0≤Z≤2, X+Y+Z=1.5 to 2.5; or 0≤X≤2, 0≤Y≤2, 0<Z≤2, X+Y+Z=1.5 to 2.5).
15. The semiconductor device or crystal structure of claim 14 , wherein 0<Y.
16. The semiconductor device or crystal structure of claim 13 , wherein a group III nitride crystal layer is provided directly or via a buffer layer on the oxide crystal.