Low ohmic loss radial superlattice conductors
Various examples are provided for low ohmic loss radial superlattice conductors. In one example, among others, a conductor includes a plurality of radially distributed layers that include a non-permalloy core, a permalloy layer disposed on and encircling the non-permalloy core, and a non-permalloy layer disposed on and encircling the permalloy layer. The non-permalloy core and non-permalloy layer can include the same or different materials such as, e.g., aluminum, copper, silver, and gold. In some implementations, the non-permalloy core includes a void containing air or a non-conductive material such as, e.g., a polymer. The permalloy layer can include materials such as, e.g., NiFe, FeCo, NiFeCo, or NiFeMo. In another example, a via connector includes the plurality of radially distributed layers including the permalloy layer and the non-permalloy layer disposed on and encircling the permalloy layer. The via connector can extend through glass, silicon, organic, or other types of substrates.
1. A conductor, comprising:
a plurality of radially distributed layers including:
a non-permalloy core comprising a non-conductive material;
a permalloy layer disposed on and encircling the non-permalloy core; and
a non-permalloy layer disposed on and encircling the permalloy layer, the non-permalloy layer comprising a conductive material.
2. The conductor of claim 1 , wherein the plurality of radially distributed layers comprises a plurality of permalloy layers alternating with a plurality of non-permalloy layers.
3. The conductor of claim 2 , further comprising an insulation layer disposed on and encircling an outermost non-permalloy layer of the plurality of non-permalloy layers.
4. The conductor of claim 1 , wherein the conductive material is aluminum or copper.
5. The conductor of claim 1 , wherein the non-conductive material is a polymer.
6. The conductor of claim 1 , wherein the permalloy layer comprises one of NiFe, FeCo, NiFeCo, or NiFeMo.
7. The conductor of claim 1 , wherein the conductor is a coaxial cable, where the plurality of radially distributed layers form a central conductor.
8. The conductor of claim 1 , wherein the conductor is included in one of an inductor, a transformer, an antenna, or a resonator.
9. A conductor, comprising:
a plurality of radially distributed layers including:
a non-permalloy core;
a permalloy layer disposed on and encircling the non-permalloy core; and
a non-permalloy layer disposed on and encircling the permalloy layer,
wherein the non-permalloy core and the non-permalloy layer comprise a common non-permalloy material.
10. The conductor of claim 9 , wherein the common non-permalloy material is selected from the group consisting of aluminum, copper, silver, and gold.
11. The conductor of claim 9 , wherein permeability of the conductor is based upon an applied external magnetic field level.
12. A conductor, comprising:
a plurality of radially distributed layers including:
a non-permalloy core, wherein the non-permalloy core comprises a void containing air;
a permalloy layer disposed on and encircling the non-permalloy core; and
a non-permalloy layer disposed on and encircling the permalloy layer.
13. The conductor of claim 12 , wherein the plurality of radially distributed layers comprises a plurality of permalloy layers alternating with a plurality of non-permalloy layers.
14. The conductor of claim 13 , further comprising an insulation layer disposed on and encircling an outermost non-permalloy layer of the plurality of non-permalloy layers.
15. A via interconnect, comprising:
a plurality of radially distributed layers extending through a substrate, the plurality of radially distributed layers including:
a non-permalloy core;
a permalloy layer disposed on and encircling the non-permalloy core; and
a non-permalloy layer disposed on and encircling the permalloy layer.
16. The via interconnect of claim 15 , wherein the non-permalloy core and the non-permalloy layer comprise a common non-permalloy material.
17. The via interconnect of claim 16 , wherein the common non-permalloy material is selected from the group consisting of aluminum, copper, silver, and gold.
18. The via interconnect of claim 15 , wherein the non-permalloy core comprises a void containing air or a non-conductive material.
19. The via interconnect of claim 15 , wherein the permalloy layer comprises one of NiFe, FeCo, NiFeCo, or NiFeMo.
20. The via interconnect of claim 15 , wherein the substrate is a glass substrate, a silicon substrate, or an organic substrate.