DVC utilizing MEMS resistive switches and MIM capacitors
The present invention generally relates to a MEMS DVC utilizing one or more MIM capacitors. The MIM capacitor may be disposed between the MEMS device and the RF pad or the MIM capacitor may be integrated into the MEMS device itself. The MIM capacitor ensures that a low resistance for the MEMS DVC is achieved.
1. A MEMS DVC, comprising:
a substrate;
a plurality of pull-in electrodes disposed in the substrate;
a plurality of pull-up electrodes disposed on an insulating layer;
a conducting post disposed above a RF line, wherein a top surface of the conducting post is a metal material;
a MEMS bridge device, wherein the MEMS bridge device has a upper layer and a lower layer coupled together by a conducting material, wherein the MEMS bridge device is movable, wherein the RF line and conducting post form a MIM capacitor, wherein the MIM capacitor contacts the MEMS bridge device through a window when the MEMS bridge device is in a lower positon; and
bumps disposed on a layer that is disposed on and above the plurality of pull-in electrodes, wherein the MEMS bridge device contacts the bumps when the MEMS bridge is in a lower position, wherein the bumps are disposed between the MIM capacitor and a via.
2. The MEMS DVC of claim 1 , wherein the MIM capacitor comprises the RF line, a first electrically conductive layer, an electrically insulating layer disposed on the RF line first electrically conductive layer, and a second electrically conductive layer disposed on the electrically insulating layer.
3. A method of making a MEMS DVC, comprising:
depositing a RF pad over a substrate;
forming a plurality of pull-in electrodes in the substrate;
forming a plurality of pull-up electrodes on an insulating layer;
forming a conducting post above a RF line, wherein a top surface the conducting post is a metal material;
forming bumps on a layer that is disposed on and above the plurality of pull-in electrodes; and
forming a MEMS bridge device, wherein the MEMS bridge device has a upper layer and a lower layer coupled together by a conducting material, wherein the MEMS bridge device is movable, wherein the RF line and conducting post form a MIM capacitor substrate, wherein the MIM capacitor is electrically coupled to an RF electrode, wherein the MIM capacitor contacts the MEMS bridge device through a window when the MEMS bridge device is in a lower positon, wherein the MEMS bridge device contacts the bumps when the MEMS bridge is in a lower position, wherein the bumps are disposed between the MIM capacitor and a via.
4. The method of claim 3 , wherein the MIM capacitor is formed by a method that comprises:
depositing a first electrically conductive layer over the substrate;
depositing a first electrically insulating layer over the first electrically conductive layer; and
depositing a second electrically conductive layer over the first electrically insulating layer.
5. The method of claim 4 , wherein the first electrically conductive layer comprises the RF line.
6. A method of making a MEMS DVC, comprising:
depositing a RF pad over a substrate;
forming a MEMS device within a cavity, the forming comprising:
forming a MIM capacitor over the substrate, wherein the MIM capacitor is coupled to the RF pad; and
forming one or more switching elements over the substrate, wherein the one or more switching elements are movable from a position in electrical contact with the MIM capacitor and a position spaced from the MIM capacitor; and
forming a variable resistor connecting the MIM capacitor to a reference potential, further comprising setting the value of the variable resistor based upon the following logic:
when the switching element is in an UP or DOWN position, the variable resistor will normally be set to its highest value so that the current flowing in the variable resistor will be significantly lower than the coupling between the switching element and the MIM capacitor; and
when the position of the switching element is changed from the DOWN to the UP position or from the UP to the DOWN position, the variable resistor will temporarily be set to its lowest value until the state transition is completed.
7. The method of claim 6 , wherein the MIM capacitor is formed by a method that comprises:
depositing a first electrically conductive layer over the substrate;
depositing a first electrically insulating layer over the first electrically conductive layer; and
depositing a second electrically conductive layer over the first electrically insulating layer.
8. The method of claim 7 , wherein the first electrically conductive layer comprises the RF line.