IP Library Granted Patent US 9,855,554
Granted Patent B2
US 9,855,554 · App. 14/906,335 · Granted Jan 2, 2018

Microfluidic cartridge assembly

Inventors: Donald E. Ingber (Boston, MA); Daniel Levner (Cambridge, MA); Guy Thompson, II (Lexington, MA); Christopher David Hinojosa (Cambridge, MA)
Assignee: PRESIDENT AND FELLOWS OF HARVARD COLLEGE
B01L3/502715B01L3/502707B01L3/56B01L2200/027B01L2200/0684B01L2200/0689B01L2200/12B01L2300/0645B01L2300/0816B01L2300/0874B01L2300/0887B01L2300/123B01L2400/0481B01L2400/0655
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Quick Facts
Patent No.
US 9,855,554
App. No.
14/906,335
Granted
Jan 2, 2018
Kind
B2
Abstract

According to aspects of the present invention, a cartridge assembly for transporting fluid into or out of one or more fluidic devices includes a first layer and a second layer. The first layer includes a first surface. The first surface includes at least one partial channel disposed thereon. The second layer abuts the first surface, thereby forming a channel from the at least one partial channel. At least one of the first layer and the second layer is a resilient layer formed from a pliable material. At least one of the first layer and the second layer includes a via hole. The via hole is aligned with the channel to pass fluid thereto. The via hole is configured to pass fluid through the first layer or the second layer substantially perpendicularly to the channel. Embossments are also used to define aspects of a fluidic channel.

Claims (13)

1. A cartridge assembly for transporting fluid into or out of a microfluidic device, the cartridge assembly comprising:

a first layer including a first surface, the first surface having at least one partial channel disposed thereon;

a second layer abutting the first surface, thereby forming a channel from the at least one partial channel; and

an interconnect adapter abutting one of the first or second layers, the interconnect adapter including a first via hole, the interconnect adapter being configured to connect the microfluidic device to one of the first layer or the second layer, wherein the interconnect adapter is attached to one of the first layer or the second layer using a trapping mechanism, wherein the interconnect adapter comprises a flange and the second support layer comprises a trapping feature, the trapping feature comprising an aperture having a shoulder therein, wherein the inner periphery of the aperture and shoulder form a complimentary geometry to the outer periphery of the interconnect adapter and flange, such that the interconnect adapter is prohibited from moving through the aperture by engagement of the flange with the shoulder and is attached to the second layer by said trapping mechanism;

wherein at least one of the first layer and the second layer is a resilient layer formed from a pliable material,

wherein at least one of the first layer and the second layer includes a second via hole, the second via hole being aligned with the channel to pass fluid thereto, the second via hole being configured to pass fluid through the first layer or the second layer in a direction substantially perpendicular to the channel, the first via hole being configured to pass fluid to the microfluidic device.

2. The cartridge assembly of claim 1 , wherein the first layer is a resilient layer and the second layer is a support layer.

3. The cartridge assembly of claim 1 , wherein the first layer is a resilient layer and the second layer is a resilient layer.

4. The cartridge assembly of claim 1 , wherein the at least one partial channel is disposed within the resilient layer.

5. The cartridge assembly of claim 1 , wherein the at least one partial channel is disposed in a support layer.

6. The cartridge assembly of claim 1 , wherein the first layer is permanently attached to the second layer.

7. The cartridge assembly of claim 1 , further including the microfluidic device coupled to the interconnect adapter.

8. The cartridge assembly of claim 1 , wherein one of the first layer and the second layer is a support layer, the interconnected adapter being integrated on the support layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 10, 2016
From: INGBER, DONALD E; LEVNER, DANIEL; THOMPSON, GUY, II; HINOJOSA, CHRISTOPHER DAVID
To: PRESIDENT AND FELLOWS OF HARVARD COLLEGE
Reel/Frame 038523/0405 →
Continuity (2)
Provisional Application 61856876 · Jul 22, 2013
Related Publication 20160175840A1 · Jun 23, 2016