Additive for a silicone encapsulant
View Patent ↗An additive for a silicone encapsulant has the structure: Formula (I) wherein R 1 and R 2 are each —O—Si(R 4 )(R 5 )(R 6 ) and each of R 4 , R 5 , and R 6 is independently chosen from C 1 -C 10 hydrocarbyl groups, C 1 -C 10 alkyl groups, C 2 -C 10 alkenyl groups, and C 6 -C 10 aryl groups, and wherein R 3 is independently chosen from C 1 -C 10 hydrocarbyl groups, C 1 -C 10 alkyl groups, C 2 -C 10 alkenyl groups, and C 6 -C 10 aryl groups. The additive is formed using a method that includes the step of reacting iron metal or an iron (III) compound with a hydroxyl functional organosiloxane. An encapsulant includes the additive and a polyorganosiloxane. The encapsulant can be utilized to form a device that includes an electronic component and the encapsulant disposed on the electronic component. The device is formed using a method that includes the step of disposing the encapsulant on the electronic device.
1. An additive for a silicone encapsulant, said additive having the structure:
wherein R 1 and R 2 are each —O—Si(R 4 )(R 5 )(R 6 ) and each of R 4 , R 5 , and R 6 is independently chosen from C 1 -C 10 hydrocarbyl groups, C 1 -C 10 alkyl groups, C 2 -C 10 alkenyl groups, and C 6 -C 10 aryl groups, and
wherein R 3 is independently chosen from C 1 -C 10 hydrocarbyl groups, C 1 -C 10 alkyl groups, C 2 -C 10 alkenyl groups, and C 6 -C 10 aryl groups.
2. The additive of claim 1 wherein at least 20 mol percent of a total of the groups R 3 -R 6 are methyl groups.
3. The additive of claim 1 wherein at least 20 mol percent of a total of the groups R 3 -R 6 are phenyl groups.
4. The additive of claim 1 wherein each R 3 , R 4 , and R 6 is a methyl group.
5. The additive of claim 1 wherein each R 3 , R 4 , and R 6 is a phenyl group.
6. The additive of claim 1 that is further defined as having the structure:
wherein Me is methyl.
7. The additive of claim 1 that is further defined as having the structure:
wherein Me is methyl and Ph is phenyl.
8. The additive of claim 1 that is further defined as:
a reaction product of a reaction of an iron alkoxide and a hydroxyl functional organosiloxane; or
a reaction product of a reaction of iron metal and a hydroxyl functional organosiloxane.
9. The additive of claim 8 wherein the hydroxyl functional organosiloxane has the formula M 1 D R,OH M 2 , wherein R is chosen from C 1 -C 10 hydrocarbyl groups, C 1 -C 10 alkyl groups, C 2 -C 10 alkenyl groups, and C 6 -C 10 aryl groups.
10. The additive of claim 8 wherein the hydroxyl functional organosiloxane has the structure:
wherein Me is methyl and Ph is phenyl.
11. A iron silyloxide cluster comprising 2 to 10 units of the additive of claim 1 .
12. A silicone encapsulant comprising said additive of claim 1 and a silicone.
13. A silicone encapsulant comprising:
A. an additive having the structure:
wherein R 1 and R 2 are each —O—Si(R 4 )(R 5 )(R 6 ) and each of R 4 , R 5 , and R 6 is independently chosen from C 1 -C 10 hydrocarbyl groups, C 1 -C 10 alkyl groups, C 2 -C 10 alkenyl groups, and C 6 -C 10 aryl groups, and
wherein R 3 is independently chosen from C 1 -C 10 hydrocarbyl groups, C 1 -C 10 alkyl groups, C 2 -C 10 alkenyl groups, and C 6 -C 10 aryl groups; and
B. a polyorganosiloxane.
14. A device comprising an electronic component and said encapsulant of claim 13 .
15. A method of making an additive having the structure:
wherein R 1 and R 2 are each —O—Si(R 4 )(R 5 )(R 6 ) and each of R 4 , R 5 , and R 6 is independently chosen from C 1 -C 10 hydrocarbyl groups, C 1 -C 10 alkyl groups, C 2 -C 10 alkenyl groups, and C 6 -C 10 aryl groups, and
wherein R 3 is independently chosen from C 1 -C 10 hydrocarbyl groups, C 1 -C 10 alkyl groups, C 2 -C 10 alkenyl groups, and C 6 -C 10 aryl groups,
wherein the method comprises the step of reacting iron metal or an iron (III) compound with a hydroxyl functional organosiloxane.