IP Library › Granted Patent US 10,215,781
Granted Patent B2
US 10,215,781 · App. 14/908,605 · Granted Feb 26, 2019

Current sensor

Inventors: Kenji Suzuki (Tokyo, JP); Hideto Imajo (Tokyo, JP); Daigo Takagi (Tokyo, JP)
Assignee: Asahi Kasei Microdevices Corporation
G01R15/207G01R19/0092G01R1/00H01L21/00H01L2221/00H01L2224/48091H01L2224/48137H01L2224/48247H01L2924/181
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Quick Facts
Patent No.
US 10,215,781
App. No.
14/908,605
Granted
Feb 26, 2019
Kind
B2
Abstract

To provide a current sensor excellent in insulation resistance. A current sensor ( 1 ) includes a conductor ( 10 ); a support part ( 30 ) for supporting a signal processing IC ( 20 ); a magnetoelectric conversion element ( 13 ) configured to be electrically connectable to the signal processing IC ( 20 ), and arranged in a gap ( 10 a ) of the conductor ( 10 ) so as to detect a magnetic field generated by a current flowing through the conductor ( 10 ); and an insulation member ( 14 ) supporting the magnetoelectric conversion element ( 13 ).

Claims (50)

1. A current sensor comprising:

a conductor having a gap;

a support part for supporting a signal processing IC, the support part having a space for electrically insulating the support part from the conductor in plan view;

a magnetoelectric conversion element configured to be electrically coupled to the signal processing IC, and disposed in the gap of the conductor so as to detect a magnetic field generated by a current flowing through the conductor; and

an insulation member supporting the magnetoelectric conversion element,

wherein the conductor, the support part, the magnetoelectric conversion element, and the insulation member are sealed with resin and accommodated inside a house formed by the resin.

2. The current sensor according to claim 1 , further comprising a signal terminal part having a lead terminal, wherein the support part is configured to be electrically coupled to the signal terminal part.

3. The current sensor according to claim 1 , wherein the conductor is arranged so as not to contact with the insulation member.

4. The current sensor according to claim 3 , wherein:

the conductor has a level difference, and

the conductor is arranged so as not to contact with the insulation member by the level difference.

5. The current sensor according to claim 3 , wherein the resin is filled up between the conductor and the insulation member.

6. The current sensor according to claim 1 , wherein the insulation member is arranged so as to contact with the conductor.

7. The current sensor according to claim 1 , wherein the insulation member is arranged so as to contact with a surface opposite to a surface on which the signal processing IC of the support part is arranged.

8. The current sensor according to claim 1 , wherein the conductor has a U-, V- or C-shaped current path.

9. The current sensor according to claim 1 , wherein the magnetoelectric conversion element is arranged in a gap of the U-, V- or C-shaped current path.

10. The current sensor according to claim 8 , wherein the U-, V- or C-shaped current path is open in a direction opposite to a direction in which the support part lies in plan view.

11. The current sensor according to claim 1 , wherein the magnetoelectric conversion element is configured so as to be electrically insulated from the conductor by being supported by the insulation member.

12. The current sensor according to claim 1 , wherein a pressure-sensitive adhesive layer or an adhesive layer is provided between the insulation member and the magnetoelectric conversion element.

13. The current sensor according to claim 1 , wherein the insulation member is an insulation tape or an insulation sheet applied with pressure-sensitive adhesives or adhesives.

14. The current sensor according to claim 1 , wherein the magnetoelectric conversion element is die bonded with the insulation member using a die attach film.

15. The current sensor according to claim 1 , wherein the magnetoelectric conversion element is a hall element or a magnetoresistive element.

16. The current sensor according to claim 1 , wherein the magnetoelectric conversion element is arranged by being dropped downward into the gap of the conductor as deep as the thickness of the conductor.

17. The current sensor according to claim 1 , wherein the magnetoelectric conversion element is arranged on the insulation member so that the height of the magnetic sensitive surface of the magnetoelectric conversion element is substantially equal to the height of the conductor.

18. The current sensor according to claim 1 , wherein the magnetoelectric conversion element is arranged on the insulation member so that the height of the magnetic sensitive surface of the magnetoelectric conversion element is substantially equal to the center height in the thickness direction.

19. The current sensor according to claim 1 , wherein:

the support part is formed with a concave portion, the concave portion is recessed in the middle of the support part toward the conductor side in plan view, and each of both sides of the concave portion has a protrusion portion projecting toward the conductor side,

the conductor has a convex portion extending along the concave portion and the protrusion portion of the support part in plan view, and

the insulation member contacts the back side of the protrusion portion.

20. The current sensor according to claim 1 , wherein the signal processing IC has a bias circuit for applying an excited current to the magnetoelectric conversion element, a correction circuit configured to correct a signal obtained from the magnetoelectric conversion element, and an amplification circuit for amplifying the corrected signal.

21. The current sensor according to claim 1 , further comprising a magnetic material formed on the magnetic sensitive surface of the magnetoelectric conversion element.

22. A current sensor comprising:

a conductor having a gap;

a support part for supporting a signal processing IC, the support part having a space for electrically insulating the support part from the conductor in plan view;

a magnetoelectric conversion element configured to be electrically coupled to the signal processing IC, and disposed in the gap of the conductor so as to detect a magnetic field generated by a current flowing through the conductor; and

an insulation member supporting the magnetoelectric conversion element,

wherein the conductor is arranged so as not to make contact with the insulation member, and

wherein resin is filled up between the conductor and the insulation member.

23. A current sensor comprising:

a conductor having a gap;

a support part for supporting a signal processing IC, the support part having a space for electrically insulating the support part from the conductor in plan view;

a magnetoelectric conversion element configured to be electrically coupled to the signal processing IC, and disposed in the gap of the conductor so as to detect a magnetic field generated by a current flowing through the conductor; and

an insulation member supporting the magnetoelectric conversion element,

wherein a pressure-sensitive adhesive layer or an adhesive layer is provided between the insulation member and the magnetoelectric conversion element.

24. A current sensor comprising:

a conductor having a gap;

a support part for supporting a signal processing IC, the support part having a space for electrically insulating the support part from the conductor in plan view;

a magnetoelectric conversion element configured to be electrically coupled to the signal processing IC, and disposed in the gap of the conductor so as to detect a magnetic field generated by a current flowing through the conductor; and

an insulation member supporting the magnetoelectric conversion element,

wherein the insulation member is an insulation tape or an insulation sheet applied with pressure-sensitive adhesives or adhesives.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2016
From: SUZUKI, KENJI; IMAJO, HIDETO; TAKAGI, DAIGO
To: ASAHI KASEI MICRODEVICES CORPORATION
Reel/Frame 037618/0346 →
Priority Claims (1)
JP 2013/157857 · Jul 30, 2013 · national
Continuity (1)
Related Publication 20160187388A1 · Jun 30, 2016