Laser processing method and laser processing apparatus
Provided is a laser processing method in which a laser processing head for irradiating, with at least a short-pulse laser, a processed article having a protection layer laminated to a metal layer is used to process the processed article, whereby high-quality, highly accurate processing is possible by means of a short-pulse laser processing step for irradiating the protection layer with the short-pulse laser and ablating the protection layer, and a metal layer processing step for ablating the metal layer in the area that was ablated during the short-pulse laser processing step.
1. A laser processing method for processing a processed article using a laser processing head radiating a short-pulse laser and a fiber laser that process the processed article,
wherein the processed article has a laminated structure in which a protection layer is laminated to a metal layer, and
wherein the laser processing method comprises:
when the protection layer is laminated to the metal layer before the laser processing, executing either,
a first short-pulse laser processing step for irradiating the protection layer with the short-pulse laser and ablating the protection layer, a distance between an end surface of the short-pulse laser and an ablated surface of the protection layer being a first distance, the first short-pulse laser processing step forming a heat-affected layer having a first thickness on the ablated surface of the protection layer; and
a first metal layer processing step for ablating the metal layer with the fiber laser in an area ablated in the first short-pulse laser processing step, the first metal layer processing step forming a heat-affected layer having a second thickness greater than the first thickness on the ablated surface of the metal layer, a distance between an end surface of the fiber laser and an ablated surface of the metal layer being a second distance larger than the first distance sufficient to prevent the fiber laser from hitting the heat-affected layer formed on the protection layer, or
a second metal layer processing step for collectively ablating the protection layer and the metal layer with the fiber laser, and
a second short-pulse laser processing step for irradiating the protection layer including an end surface of an area ablated in the second metal layer processing step with the short-pulse laser and ablating the protection layer,
wherein in the first short-pulse laser processing step, a position where the processed article is irradiated with the short-pulse laser, is rotated.
2. The laser processing method according to claim 1 ,
wherein the short-pulse laser processing step ablates the metal layer to a depth of 0.001 mm or more and 50% or less of the thickness of the metal layer in a direction orthogonal to the surface of the metal layer.
3. The laser processing method according to claim 1 ,
wherein the short-pulse laser processing step ablates the metal layer to a depth of 0.001 mm or more and 50% or less of the thickness of the metal layer in a direction in which the short pulse laser is radiated.
4. The laser processing method according to claim 1 ,
wherein the short-pulse laser processing step and the metal layer processing step are the processing for forming a hole in the processed article, and
wherein, in the short-pulse laser processing step, a larger diameter hole, having a larger diameter than the hole formed in the metal layer in the metal layer processing step, is formed in the protection layer.
5. The laser processing method according to claim 1 ,
wherein the short-pulse laser processing step is the processing for forming a ring-shaped opening in the protection layer,
wherein the metal layer processing step is the processing for forming a hole in the processed article, and
wherein in the short-pulse laser processing step, a larger diameter hole, having a larger diameter than the hole formed in the metal layer in the metal layer processing step, is formed in the protection layer.
6. The laser processing method according to claim 1 ,
wherein the protection layer is formed of a material resisting heat or a material resisting wear.
7. The laser processing method according to claim 1 ,
wherein the laser processing head includes a laser turner turning the short-pulse laser with respect to the processed article, and a focusing optical condenser that condenses the short-pulse laser turned by the laser turner.