IP Library › Granted Patent US 10,323,884
Granted Patent B2
US 10,323,884 · App. 14/914,767 · Granted Jun 18, 2019

Heat exchanger and method for manufacturing same

Inventors: Youngjoo Yee (Seoul, KR); Kyungkyoo Chang (Incheon, KR); Heeseok Jung (Hwaseong-si, KR); Chungguk Lee (Incheon, KR)
Assignees: LG ELECTRONICS INC.; C3 CO., LTD.
F28D15/046B81C1/00F28D15/0233F28F21/085B23P15/26
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Quick Facts
Patent No.
US 10,323,884
App. No.
14/914,767
Granted
Jun 18, 2019
Kind
B2
Abstract

A heat exchanger according to the present invention comprises: a plate-shaped body having an interior space in which a working fluid is vaporized or condensed and flows; and a wick located within the body, the wick comprising a plurality of needle-shaped particles between which the working fluid flows. By forming a wick comprising needle-shaped particles, the heat exchanger according to the embodiments of the present invention can improve the porosity of the wick compared to conventional groove or mesh-shaped or sintered wicks. Accordingly, the working fluid is capable of flowing inside the wick more smoothly than in the conventional wicks, thereby improving a heat exchange rate or heat exchange performance.

Claims (25)

1. A heat exchanger comprising:

a body having an inner space in which a working fluid is vaporized or condensed, and thus capable of flowing;

a wick disposed within the body and having a plurality of needle-shaped particles, wherein the working fluid flows among the plurality of needle-shaped particles; and

a plurality of guide blocks provided within the body, each guide block having a bar shape,

wherein the wick comprises:

a first layer formed on the body; and

a second layer formed on the first layer so that the first layer is between the second layer and the body, the second layer composed of the plurality of needle-shaped particles,

wherein the second layer has a greater thickness than the first layer,

wherein the plurality of guide blocks is disposed spaced apart from each other in a horizontal direction of the body,

wherein the body is divided into a plurality of spaces by the plurality of guide blocks and the wick is formed in each of the plurality of spaces between the plurality of guide blocks,

wherein the wick is made of copper, and

wherein the plurality of guide blocks is made of copper, the wick formed by electroplating.

2. The heat exchanger of claim 1 , wherein the body comprises:

a base member having a plate shape; and

a cover member having a plate shape disposed on the base member and spaced apart from the base member,

wherein the plurality of guide blocks is disposed between the base member and the cover member.

3. The heat exchanger of claim 1 , wherein the body comprises copper (Cu).

4. The heat exchanger of claim 1 , wherein the first layer and the second layer comprise copper (Cu).

5. The heat exchanger of claim 1 , wherein the second layer has a thickness of 10 to 30 times greater than the first layer.

6. The heat exchanger of claim 1 , wherein a plurality of flow channels are formed between the guide blocks, and

wherein the wick is in the flow channels.

7. The heat exchanger of claim 6 , further comprising a cover contacting a top of the guide blocks to form a top of the flow channels.

8. The heat exchanger of claim 1 , wherein the body has a base member and the guide blocks, and

wherein the guide blocks are on a top surface of the base member.

9. The heat exchanger of claim 8 , wherein the body is rectangular.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 29, 2016
From: YEE, YOUNGJOO; CHANG, KYUNGKYOO; JUNG, HEESEOK; LEE, CHUNGGUK
To: LG ELECTRONICS INC.; C3 CO., LTD.
Reel/Frame 037854/0770 →
Priority Claims (2)
KR 10-2013-0106721 · Sep 5, 2013 · national
KR 10-2014-0061474 · May 22, 2014 · national
Continuity (1)
Related Publication 20160209123A1 · Jul 21, 2016