Substrate carrier with integrated electrostatic chuck
A substrate carrier adapted to use in a processing system includes an electrode assembly and a support base. The electrode assembly is configured to generate an electrostatic chucking force for securing a substrate to the substrate carrier. The support base has a heating/cooling reservoir formed therein. The electrode assembly and the support base form an unitary body configured for transport within a processing system. A quick disconnect is coupled to the body and configured to trap a heat regulating medium in the reservoir heating/cooling reservoir when the body is decoupled from a source of heat regulating medium.
1. A substrate carrier adapted to use in a processing system, the substrate carrier comprising:
a support base;
an electrode assembly having interleaved electrode fingers formed therein disposed on the support base;
a controller on-board the substrate carrier, the controller adapted to control a state of the electrode assembly; and
a connector coupled to the support base configured to electrically disconnect a power source to the electrode assembly, the support base and the electrode assembly comprising a unitary body adapted to be transported within a processing system.
2. The substrate carrier of claim 1 , wherein the connector comprises:
at least one of a contact pad, a plug and socket connector, a banana connector, a spade connector and a screw terminal.
3. The substrate carrier of claim 1 , further comprising:
an energy storage device on-board the substrate carrier and coupled to the electrode assembly.
4. The substrate carrier of claim 3 , wherein the energy storage device is electrically coupled to the electrode assembly and the connector.
5. The substrate carrier of claim 1 further comprising:
a rail extending from a side of the support base.
6. The substrate carrier of claim 5 , wherein the rail is configured to interface with a drive system adapted to transport the body through the system.
7. The substrate carrier of claim 1 , wherein the electrode assembly comprises:
an array of independently controllable electrode assemblies.
8. The substrate carrier of claim 1 , wherein the electrode assembly comprises:
a plurality of distributed electrodes.
9. The substrate carrier of claim 8 , wherein the distributed electrodes further comprises:
at least a first electrode interleaving with a second electrode.
10. The substrate carrier of claim 8 , wherein the energy storage device comprises:
at least one of a battery, capacitor, supercapacitor and ultrabattery.
11. The substrate carrier of claim 1 further comprising:
a reservoir disposed in the support base.
12. The substrate carrier of claim 11 , wherein the reservoir is coupled to a connector having a check or isolation valve.
13. The substrate carrier of claim 1 further comprising:
a connector for providing gas to a surface of the substrate carrier.
14. A processing system, comprising:
(a) a substrate carrier comprising:
a support base;
a plurality of electrode assemblies disposed on the support base;
a controller on-board the substrate carrier, the controller adapted to control a state of the electrode assembly; and
a connector coupled to the support base configured to electrically disconnect a power source to the electrode assembly, the support base and the electrode assembly comprising a unitary body adapted to be transported within a processing system;
(b) a processing chamber adapted to receive the substrate carrier having a substrate electrostatically coupled thereto; and
(c) a mating connector operable to automatically couple to the connector.
15. The processing system of claim 14 , wherein the mating connector is located in at least one of a loading system, a load lock chamber and a processing chamber.
16. The processing system of claim 14 , further comprising:
an energy storage device on-board the substrate carrier and coupled to the electrode assembly.
17. A method for transporting a substrate in a processing system, the method comprising:
transferring a substrate onto a substrate carrier, wherein the substrate carrier comprises a controller on-board adapted to control a state of an electrode assembly in the substrate carrier;
electrostatically chucking the substrate to the substrate carrier by powering an electrode assembly electrically coupled to a power source;
electrically disconnecting the power source from the substrate carrier when the substrate is chucked on the substrate carrier; and
transferring the substrate while electrostatically chucked to the substrate carrier in a substantially vertical orientation.
18. The method of claim 14 , wherein electrically disconnecting the power source further comprises:
automatically disconnecting the power source from the substrate carrier in a processing chamber or in a substrate loading station.