IP Library Granted Patent US 9,711,600
Granted Patent B2
US 9,711,600 · App. 14/916,801 · Granted Jul 18, 2017

Semiconductor device and method of manufacturing the same, power conversion device, three-phase motor system, automobile, and railway vehicle

Inventors: Kazuhiro Mochizuki (Tokyo, JP); Norifumi Kameshiro (Tokyo, JP)
Assignee: Hitachi, Ltd.
H01L29/1608B60L11/1803H01L29/0615H01L29/0619H01L29/36H01L29/6606H01L29/8611H01L29/872H02M7/537H02P27/06
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,711,600
App. No.
14/916,801
Granted
Jul 18, 2017
Kind
B2
Abstract

In a semiconductor device having a silicon carbide device, a technique capable of suppressing variation in a breakdown voltage and achieving reduction in an area of a termination structure is provided. In order to solve the above-described problem, in the present invention, in a semiconductor device having a silicon carbide device, a p-type first region and a p-type second region provided to be closer to an outer peripheral side than the first region are provided in a junction termination portion, a first concentration gradient is provided in the first region, and a second concentration gradient larger than the first concentration gradient is provided in the second region.

Claims (19)

1. A semiconductor device comprising:

a semiconductor substrate;

an n-type semiconductor layer formed on a front surface of the semiconductor substrate; and

a junction termination portion formed on an upper surface side of the semiconductor layer,

wherein the junction termination portion includes:

a p-type first semiconductor region having a first impurity concentration;

a p-type second semiconductor region having a second impurity concentration lower than the first impurity concentration; and

a p-type third semiconductor region having a third impurity concentration lower than the second impurity concentration,

the second semiconductor region is sandwiched by the first semiconductor regions in a first region,

the third semiconductor region is sandwiched by the first semiconductor regions in a second region provided to be closer to an end portion side of the semiconductor substrate than the first region, and

only the third semiconductor region exists in a third region provided to be closer to an end portion side of the semiconductor substrate than the second region.

2. The semiconductor device according to claim 1 ,

wherein the semiconductor layer is made of silicon carbide.

3. The semiconductor device according to claim 1 ,

wherein the first region, the second region, and the third region contain aluminum.

4. A power conversion device including the semiconductor device according to claim 1 .

5. A three-phase motor system including the power conversion device according to claim 4 .

6. An automobile including the three-phase motor system according to claim 5 .

7. A railway vehicle including the three-phase motor system according to claim 5 .

Assignments (3)
CHANGE OF NAME Recorded Apr 30, 2025
From: HITACHI POWER SEMICONDUCTOR DEVICE LTD.
To: MINEBEA POWER SEMICONDUCTOR DEVICE INC.
Reel/Frame 071142/0232 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 5, 2018
From: HITACHI, LTD.
To: HITACHI POWER SEMICONDUCTOR DEVICE, LTD.
Reel/Frame 046268/0067 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 7, 2016
From: MOCHIZUKI, KAZUHIRO; KAMESHIRO, NORIFUMI
To: HITACHI, LTD.
Reel/Frame 037906/0938 →
Continuity (1)
Related Publication 20160218187A1 · Jul 28, 2016