Metal-assisted etch combined with regularizing etch
In an aspect of the disclosure, a process for forming nanostructuring on a silicon-containing substrate is provided. The process comprises (a) performing metal-assisted chemical etching on the substrate, (b) performing a clean, including partial or total removal of the metal used to assist the chemical etch, and (c) performing an isotropic or substantially isotropic chemical etch subsequently to the metal-assisted chemical etch of step (a). In an alternative aspect of the disclosure, the process comprises (a) performing metal-assisted chemical etching on the substrate, (b) cleaning the substrate, including removal of some or all of the assisting metal, and (c) performing a chemical etch which results in regularized openings in the silicon substrate.
1. A silicon-containing substrate having a top surface which comprises nanostructuring which comprises rounded depressions and which comprises residual metal deposits in at least some of the substantially rounded depressions, terminal end portions of the rounded depressions being substantially rounded and smooth on the nanoscale.
2. The substrate of claim 1 , wherein the residual metal deposits comprise at least about 10 10 atoms/cm 2 , 10 11 atoms/cm 2 , or 10 12 atoms/cm 2 .
3. The substrate of claim 1 , wherein the residual metal comprises silver.
4. The substrate of claim 1 , wherein the substrate forms part of a solar cell.
5. The substrate of claim 1 , wherein the density of depressions is at least about 100 depression per μm 2 .