Radiation tolerant device structure

1. A method for forming a radiation-hardened device, the method comprising the steps of:

forming fin masks on a silicon-on-insulator (SOI) layer of an SOI wafer, wherein the SOI wafer comprises the SOI layer separated from a substrate by a buried insulator;

patterning fins in the SOI layer using the fin masks; and

implanting at least one dopant into exposed portions of the buried insulator between the fins to increase a radiation hardness of the device structure by providing a path in the buried insulator for charge to dissipate,

wherein the fin masks are left in place during the implanting step to prevent damage to the fins.

2. The method of claim 1 , wherein the fin masks are formed on the SOI layer by the following steps:

forming one or more mandrels on the SOI layer;

forming spacers on opposite sides of the mandrels; and

removing the mandrels selective to the spacers, wherein the fins masks comprise the spacers on the SOI layer.

3. The method of claim 1 , wherein the dopant is selected from the group consisting of: Si, N, Xe, Ge, As, P, In, B, BF 2 , and combinations thereof.

4. The method of claim 1 , wherein the dopant is implanted into the buried insulator at a dose of from about 1×10 15 to about 8×10 16 , and ranges therebetween.

5. The method of claim 1 , further comprising the steps of:

forming at least one dummy gate over a portion of each of the fins that will serve as a channel region of the radiation-hardened device;

forming doped source and drain regions on portions of the fins extending out from either side of the dummy gate;

burying the dummy gate in a dielectric material;

removing the dummy gate selective to the dielectric material, forming a gate trench in the dielectric material; and

forming a replacement gate in the gate trench.

6. The method of claim 5 , further comprising the step of:

forming spacers on opposite sides of the dummy gate.

7. A radiation-hardened device, comprising:

fins patterned in an SOI layer of an SOI wafer, wherein the SOI wafer comprises the SOI layer separated from a substrate by a buried insulator;

fin masks covering each of the fins; and

at least one dopant implanted into exposed portions of the buried insulator between the fins which increases a radiation hardness of the device structure by providing a path in the buried insulator for charge to dissipate.

8. The radiation-hardened device of claim 7 , wherein the dopant comprises an element selected from the group consisting of: Si, N, Xe, Ge, As, P, In, B, BF 2 , and combinations thereof.

9. The radiation-hardened device of claim 7 , wherein the dopant is implanted into the buried insulator at a dose of from about 1×10 15 to about 8×10 16 , and ranges therebetween.

10. The radiation-hardened device of claim 7 , further comprising:

at least one gate over a portion of each of the fins that will serve as a channel region of the radiation-hardened device; and

doped source and drain regions formed on portions of the fins extending out from either side of the gate.

11. The radiation-hardened device of claim 10 , further comprising:

spacers on opposite sides of the gate.

12. A method for forming a radiation-hardened device, the method comprising the steps of:

forming fin masks on a bulk substrate;

patterning fins in the bulk substrate using the fin masks;

depositing an insulator in between the fins; and

implanting at least one dopant into the insulator between the fins to increase a radiation hardness of the device structure by providing a path in the insulator for charge to dissipate,

wherein the fin masks are left in place during the implanting step to prevent damage to the fins.

13. The method of claim 12 , wherein the dopant is selected from the group consisting of: Si, N, Xe, Ge, As, P, In, B, BF 2 , and combinations thereof.

14. The method of claim 12 , wherein the dopant is implanted into the insulator at a dose of from about 1×10 15 to about 8×10 16 , and ranges therebetween.

15. The method of claim 12 , further comprising the steps of:

forming at least one dummy gate over a portion of each of the fins that will serve as a channel region of the radiation-hardened device;

forming doped source and drain regions on portions of the fins extending out from either side of the dummy gate;

burying the dummy gate in a dielectric material;

removing the dummy gate selective to the dielectric material, forming a gate trench in the dielectric material; and

forming a replacement gate in the gate trench.

16. The method of claim 15 , further comprising the step of:

forming spacers on opposite sides of the dummy gate.

17. A radiation-hardened device, comprising:

fins patterned in a bulk substrate;

fin masks covering each of the fins;

an insulator in between the fins; and

at least one dopant implanted into the insulator between the fins which increases a radiation hardness of the device structure by providing a path in the insulator for charge to dissipate.

18. The radiation-hardened device of claim 17 , wherein the dopant comprises an element selected from the group consisting of: Si, N, Xe, Ge, As, P, In, B, BF 2 , and combinations thereof.

19. The radiation-hardened device of claim 17 , wherein the dopant is implanted into the insulator at a dose of from about 1×10 15 to about 8×10 16 , and ranges therebetween.

20. The radiation-hardened device of claim 17 , further comprising:

at least one gate over a portion of each of the fins that will serve as a channel region of the radiation-hardened device; and

doped source and drain regions formed on portions of the fins extending out from either side of the gate.