IP Library › Granted Patent US 11,071,224
Granted Patent B2
US 11,071,224 · App. 14/922,753 · Granted Jul 20, 2021

Functional panel, method for manufacturing the same, module, data processing device

Inventors: Shunpei Yamazaki (Tokyo, JP); Kohei Yokoyama (Kanagawa, JP); Yoshiharu Hirakata (Kanagawa, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
H05K7/02G09F9/00H01L23/10H01L51/5237H01L51/5253H01L51/5265
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Quick Facts
Patent No.
US 11,071,224
App. No.
14/922,753
Granted
Jul 20, 2021
Kind
B2
Abstract

A novel, highly convenient or reliable functional panel is provided. A novel, highly convenient or reliable method for manufacturing a functional panel is provided. The functional panel includes a first base; a second base having a region overlapping with the first base; a bonding layer that bonds the first base to the second base; and an insulating layer in contact with the first base, the second base, and the bonding layer. With this structure, an opening which is formed easily in a region where the bonding layer is in contact with the first base or the second base can be filled with the insulating layer, which can prevent impurities from being diffused into the functional layer located in a region surrounded by the first base, the second base, and the bonding layer that bonds the first base to the second base.

Claims (40)

1. A functional panel comprising:

a first insulating layer;

a second insulating layer over and in contact with the first insulating layer;

a first base over and in contact with the second insulating layer;

a second base over the first base;

a bonding layer between the first base and the second base, wherein the bonding layer is positioned inside an end portion of the second base so that the second base has a protruding part that protrudes from the bonding layer;

a functional layer comprising a light-emitting element with a microcavity structure including a reflective film, a semi-transmissive and semi-reflective film, and a layer containing a light-emitting organic compound over the first base; and

a third insulating layer being a nitride layer and being over and in contact with an entire top surface of the second base including the protruding part and with the bonding layer,

wherein the first insulating layer and the second insulating layer overlap with the functional layer,

wherein the second insulating layer is one of an oxide layer, a fluoride layer, and a sulfide layer, and

wherein the bonding layer covers the functional layer.

2. The functional panel according to claim 1 , wherein the first insulating layer and the second insulating layer are the same material.

3. A module comprising:

the functional panel according to claim 1 ; and

an FPC or a touch sensor.

4. An data processing device comprising:

the functional panel according to claim 1 ; and

a microphone, an antenna, a battery, an operation switch, or a housing.

5. The functional panel according to claim 1 ,

wherein each of the first base and the second base has flexibility.

6. A functional panel comprising:

a first insulating layer;

a second insulating layer over and in contact with the first insulating layer;

a first base over and in contact with the second insulating layer;

a second base over the first base;

a bonding layer between the first base and the second base, wherein the bonding layer is positioned inside an end portion of the second base so that the second base has a protruding part that protrudes from the bonding layer;

a functional layer comprising a light-emitting element with a microcavity structure including a reflective film, a semi-transmissive and semi-reflective film, and a layer containing a light-emitting organic compound over the first base;

a third insulating layer being a nitride layer and being over and in contact with an entire top surface of the second base including the protruding part and with the bonding layer,

wherein the first insulating layer, the second insulating layer, and the third insulating layer overlap with the functional layer,

wherein the second insulating layer is one of an oxide layer, a fluoride layer, and a sulfide layer, and

wherein the bonding layer covers the functional layer.

7. The functional panel according to claim 6 , wherein the first insulating layer and the second insulating layer are the same material.

8. A module comprising:

the functional panel according to claim 6 ; and

an FPC or a touch sensor.

9. An data processing device comprising:

the functional panel according to claim 6 ; and

a microphone, an antenna, a battery, an operation switch, or a housing.

10. The functional panel according to claim 6 ,

wherein each of the first base and the second base has flexibility.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 3, 2015
From: YAMAZAKI, SHUNPEI; YOKOYAMA, KOHEI; HIRAKATA, YOSHIHARU
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 036951/0450 →
Priority Claims (2)
JP JP2014-219065 · Oct 28, 2014 · national
JP JP2014-219066 · Oct 28, 2014 · national
Continuity (1)
Related Publication 20160120054A1 · Apr 28, 2016