Semiconductor device carrier tape with image sensor detectable dimples
A semiconductor device carrier tape with image sensor detectable dimples is disclosed. The dimpled carrier tape is formed of a flexible strip of material. A plurality of pockets are disposed spaced apart along the length of the flexible strip of material. Each pocket is configured to hold a semiconductor device. A dimple is formed in each of the plurality of pockets where each dimple has a peripheral edge and a bottom surface. Detection of the dimple by an image sensor facilitates alignment of a semiconductor device with the pocket and precise placement of the semiconductor device in the pocket.
1. A semiconductor device carrier tape, comprising:
a flexible strip of material;
a plurality of pockets disposed spaced apart along a length of the flexible strip of material, each pocket having a primary bottom surface and being configured to hold a semiconductor device; and
a dimple formed in each of the plurality of pockets, each dimple comprising a peripheral edge and a bottom surface, the bottom surface of each dimple including a surface texture that is different from the primary bottom surface of each pocket.
2. The semiconductor device carrier tape of claim 1 , wherein the peripheral edge of the dimple is detectable by an image sensor.
3. The semiconductor device carrier tape of claim 1 , wherein the bottom surface of the dimple is detectable by the image sensor.
4. The semiconductor device carrier tape of claim 1 , further comprising a plurality of feed holes spaced apart along the length of the flexible strip of material.
5. The semiconductor device carrier tape of claim 1 , wherein the primary bottom surface of the pocket, the peripheral edge and the bottom surface of the dimple is a continuous, uninterrupted surface.
6. The semiconductor device carrier tape of claim 1 , wherein the peripheral edge is rounded.
7. The semiconductor device carrier tape of claim 1 , wherein the peripheral edge is a sloped surface.
8. The semiconductor device carrier tape of claim 1 , wherein the dimple extends from an underside of the pocket.
9. A method for placing a semiconductor device in a pocket of a carrier tape, comprising:
detecting, using an image sensor, a dimple in a pocket of a carrier tape;
aligning a semiconductor device with the pocket based on the detection of the dimple; and
placing the semiconductor device in the pocket.
10. The method of claim 9 , further comprising determining a position of the pocket from the detected dimple.
11. The method of claim 9 , wherein detecting the dimple comprises detecting a contrast between an image of a bottom surface of the pocket and an image of a peripheral edge of the dimple.
12. The method of claim 9 , wherein detecting the dimple comprises detecting a contrast between an image of a bottom surface of the pocket and an image of a bottom surface of the dimple.
13. The method of claim 12 , wherein detecting the contrast comprises detecting a surface texture of the bottom surface of the dimple.
14. The method of claim 9 , further comprising using the image sensor to detect that the dimple is covered by a previously placed semiconductor device.
15. The method of claim 9 , wherein the aligning the semiconductor device with the pocket is based on the detection of a peripheral edge of the dimple.
16. The method of claim 9 , wherein the aligning the semiconductor device with the pocket is based on detecting a bottom surface of the dimple.
17. The method of claim 9 , further comprising advancing the carrier tape after the placement of the semiconductor device.