Patent Assignment
Reel/Frame 061796/0284
Assignment of Assignor's Interest
Recorded: 2022-11-16
Pages: 8
Assignor
STMICROELECTRONICS (MALTA) LTD
Executed: 2022-11-11
Assignee
STMICROELECTRONICS INTERNATIONAL N.V.
CHEMIN DU CHAMP-DES-FILLES 39, 1228 PLAN-LES-OUATES, GENEVA, SWITZERLAND
Covered Properties
(12)
Packages for Semiconductor Devices and Methods for Assembling Same
Method of Stacking a Plurality of Dies to Form a Stacked Semiconductor Device, and Stacked Semiconductor Device
Stack of Integrated-Circuit Chips and Electronic Device
Integrated Circuit (Ic) Card Having an Ic Module and Reduced Bond Wire Stress and Method of Forming
Patent:
9,449,912 →
Application:
14/736,353 →
Semiconductor Device Carrier Tape with Image Sensor Detectable Dimples
Semiconductor Integrated Device for Acoustic Applications with Contamination Protection Element, and Manufacturing Method Thereof
Microfluidic Assembly and Methods of Forming Same
Semiconductor Packages Having Dual Encapsulation Material
Barrel Cap Attach Trays
Microfluidic Assembly and Methods of Forming Same
Electronic Device Comprising a Support Substrate and an Encapsulating Cover for an Electronic Component
Electronic Device Comprising a Support Substrate and an Encapsulating Cover for an Electronic Component
Related Assignments
(18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 29, 2014
From: CACHIA, CONRAD
To: STMICROELECTRONICS (MALTA) LTD
Reel/Frame 033842/0001 →
Assignment of Assignor's Interest
Jan 8, 2015
From: CACHIA, CONRAD; FONK, KENNETH
To: STMICROELECTRONICS (MALTA) LTD
Reel/Frame 034663/0961 →
Assignment of Assignor's Interest
May 28, 2015
From: CROBU, ANGELO; FONK, KENNETH; COFFY, ROMAIN
To: STMICROELECTRONICS (GRENOBLE 2) SAS; STMICROELECTRONICS (MALTA) LTD; STMICROELECTRONICS S.R.L.
Reel/Frame 035732/0591 →
Assignment of Assignor's Interest
Jul 7, 2015
From: ZHANG, XUEREN; GOH, KIM-YONG
To: STMICROELECTRONICS PTE LTD
Reel/Frame 036010/0970 →
Assignment of Assignor's Interest
Jul 7, 2015
From: DUCA, ROSEANNE
To: STMICROELECTRONICS (MALTA) LTD
Reel/Frame 036011/0878 →
Assignment of Assignor's Interest
Oct 29, 2015
From: SPITERI, JEREMY; ELLUL, IVAN
To: STMICROELECTRONICS (MALTA) LTD
Reel/Frame 036909/0944 →
Assignment of Assignor's Interest
Nov 17, 2015
From: FONK, KENNETH
To: STMICROELECTRONICS (MALTA) LTD
Reel/Frame 037064/0402 →
Assignment of Assignor's Interest
Nov 17, 2015
From: BRIOSCHI, ROBERTO; ADORNO, SILVIA
To: STMICROELECTRONICS S.R.L.
Reel/Frame 037064/0410 →
Assignment of Assignor's Interest
Sep 29, 2016
From: DODD, SIMON
To: STMICROELECTRONICS, INC.
Reel/Frame 039901/0533 →
Assignment of Assignor's Interest
Sep 29, 2016
From: ELLUL, IVAN; BRINCAT, CHRISTOPHER
To: STMICROELECTRONICS (MALTA) LTD
Reel/Frame 039901/0536 →
Assignment of Assignor's Interest
Dec 26, 2017
From: BONNICI, DAVID; FARRUGIA, BRENDA
To: STMICROELECTRONICS (MALTA) LTD
Reel/Frame 044485/0864 →
Assignment of Assignor's Interest
Jan 3, 2018
From: DEBONO, RYAN; PARNIS, STANLEY MARTIN; ZAMMIT, NATHAN JOHN
To: STMICROELECTRONICS (MALTA) LTD
Reel/Frame 044521/0121 →
Assignment of Assignor's Interest
Sep 17, 2018
From: LOPEZ, JEROME
To: STMICROELECTRONICS (GRENOBLE 2) SAS
Reel/Frame 046890/0845 →
Assignment of Assignor's Interest
Sep 17, 2018
From: DUCA, ROSEANNE
To: STMICROELECTRONICS (MALTA) LTD
Reel/Frame 046890/0906 →
Assignment of Assignor's Interest
Nov 1, 2022
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 061608/0496 →
Assignment of Assignor's Interest
Nov 1, 2022
From: STMICROELECTRONICS S.R.L.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 061828/0243 →
Assignment of Assignor's Interest
Nov 10, 2022
From: STMICROELECTRONICS, INC.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 061915/0364 →
Assignment of Assignor's Interest
Apr 10, 2023
From: STMICROELECTRONICS (GRENOBLE 2) SAS
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 063282/0095 →