Barrel cap attach trays
One or more embodiments are directed to cap attach trays for holding barrel caps such that a pick-and-place tool can readily identify the cap and pick the barrel cap from the cap attach tray during the manufacturing process. The cap attach trays include a receiving layer having a plurality of protrusions each of which secures a barrel cap by mating to a through-hole in the barrel cap.
1. A pick-and-place accessory tray system, comprising:
a plurality of barrel caps; and
a cap attach tray that holds the plurality of barrel caps in position when assembled with sensor packages, wherein the cap attach tray comprises:
a receiving layer having a first surface; and
a plurality of protrusions extending from the first surface, the plurality of protrusions having outer surfaces that extend into through-holes of the plurality of barrel caps, respectively, and hold the plurality of barrel caps in position on the cap attach tray.
2. The pick-and-place accessory of claim 1 wherein each protrusion of the plurality of protrusions includes a cylindrical pin, wherein each one of the cylindrical pins extend into a corresponding one of the through-holes of the plurality of barrel caps, respectively.
3. The pick-and-place accessory of claim 1 wherein each protrusion of the plurality of protrusions includes a non-cylindrical base that is coupled to a corresponding one of the cylindrical pins, wherein outer surfaces of the non-cylindrical bases are rectangular, and prevent rotation of the plurality of barrel caps when the plurality of barrel caps are held on the cap attach tray.
4. The pick-and-place accessory of claim 3 , wherein the non-cylindrical bases are rectangular cuboid bases, the rectangular cuboid bases being on the first surface of the receiving layer, and each one of the cylindrical pins being on a respective one of said rectangular cuboid bases, respectively.
5. The pick-and-place accessory of claim 1 , further comprising:
a support substrate coupled to the receiving layer, the receiving layer being inset into a recess in the supporting substrate.
6. The pick-and-place accessory of claim 1 , further comprising: a magnetic layer coupled to the receiving layer, the magnetic layer being configured to hold the plurality of barrel caps in position by magnetic force.
7. The pick-and-place accessory of claim 1 , further comprising:
a coloration layer, the coloration layer configured to be obscured by the plurality of barrel caps and visible through the respective through-holes of each one of the plurality of barrel caps.
8. The pick-and-place accessory of claim 7 wherein the receiving layer is semi-transparent and the coloration layer is positioned on a second surface of the receiving layer opposite the first surface.
9. A cap attach tray comprising:
a receiving layer having a first surface;
a plurality of protrusions extending from the first surface, the plurality of protrusions configured to extend into through-holes of a plurality of barrel caps, respectively and configured to hold the plurality of barrel caps in position on the cap attach tray; and
a coloration layer configured to be obscured by the plurality of barrel caps and visible through the respective through-holes of each one of the plurality of barrel caps, wherein the coloration layer is a sheet of colored paper.
10. A device, comprising:
a plurality of barrel caps; and
a cap attach tray that holds the plurality of barrel caps in position during assembly with sensor packages, wherein the cap attach tray comprises:
a supporting substrate; and
a barrel cap receiving layer on the supporting substrate, the receiving layer including a plurality of barrel cap protrusions, each of the barrel cap protrusions including a base on a surface of the receiving layer and a pin on the base, the pin having a column shape with a diameter equal to a first width, the base having a rectangular cuboid shape with a second width, the second width being greater than the first width.
11. The device of claim 10 wherein the receiving layer is inset in a recess in the supporting substrate.
12. The device of claim 11 wherein an upper surface of each of the pins is coplanar with an upper surface of the supporting substrate.
13. The device of claim 10 , further comprising a magnetic layer coupled between the supporting substrate and the receiving layer, the magnetic layer inset in a recess in the supporting substrate.
14. The device of claim 10 , further comprising a coloration layer coupled to the receiving layer.
15. The device of claim 14 , wherein the coloration layer is positioned between the receiving layer and the supporting substrate.