Patent Assignment
Reel/Frame 036011/0878
Assignment of Assignor's Interest
Recorded: 2015-07-07
Pages: 3
Assignor
DUCA, ROSEANNE
Executed: 2015-06-05
Assignee
STMICROELECTRONICS (MALTA) LTD
INDUSTRIAL CENTER, INDUSTRIES ROAD, KIRKOP, ZRQ 10, MALTA
Covered Property
(1)
Integrated Circuit (Ic) Card Having an Ic Module and Reduced Bond Wire Stress and Method of Forming
Patent:
9,449,912 →
Application:
14/736,353 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 7, 2015
From: ZHANG, XUEREN; GOH, KIM-YONG
To: STMICROELECTRONICS PTE LTD
Reel/Frame 036010/0970 →
Assignment of Assignor's Interest
Nov 1, 2022
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 061608/0496 →
Assignment of Assignor's Interest
Nov 16, 2022
From: STMICROELECTRONICS (MALTA) LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 061796/0284 →