Patent Assignment
Reel/Frame 036010/0970
Assignment of Assignor's Interest
Recorded: 2015-07-07
Pages: 3
Assignee
STMICROELECTRONICS PTE LTD
28 ANG MO KIO, INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property
(1)
Integrated Circuit (Ic) Card Having an Ic Module and Reduced Bond Wire Stress and Method of Forming
Patent:
9,449,912 →
Application:
14/736,353 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 7, 2015
From: DUCA, ROSEANNE
To: STMICROELECTRONICS (MALTA) LTD
Reel/Frame 036011/0878 →
Assignment of Assignor's Interest
Nov 1, 2022
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 061608/0496 →
Assignment of Assignor's Interest
Nov 16, 2022
From: STMICROELECTRONICS (MALTA) LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 061796/0284 →