Embedded package in PCB build up
View Patent ↗An apparatus including a printed circuit board including a body of a plurality of alternating layers of conductive material and insulating material; and a package including a die disposed within the body of the printed circuit board. A method including forming a printed circuit board including a core and a build-up section including alternating layers of conductive material and insulating material coupled to the core; and coupling a package including a die to the core of the printed circuit board such that at least a portion of a sidewall of the package is embedded in at least a portion of the build-up section. An apparatus including a printed circuit board including a body; a computing device including a package including a microprocessor disposed within the body of the printed circuit board; and a peripheral device that provides input or output to the computing device.
1. A method comprising:
forming a printed circuit board comprising a core and a build-up section wherein the build-up section comprises alternating layers of conductive material and insulating material coupled to the core;
coupling a package to the core of the printed circuit board such that the package is embedded in at least a portion of the build-up section, wherein the package comprises a first plurality of contact points on a first side of the package and a second plurality of contact points on an opposite second side of the package, wherein coupling the package to the core comprises coupling the second plurality of contact points to a layer of conductive material of the core; and
coupling a die to the first side of the package within a perimeter of the first plurality of contact points on the first side of the package.
2. The method of claim 1 , wherein forming the printed circuit board comprises coupling the build-up section of the core after coupling the package to the core.
3. The method of claim 1 , wherein the core comprises a plurality of core contact points and coupling the package to the core comprises coupling the second plurality of contact points of the package to the plurality of core contact points.
4. The method of claim 1 , further comprising forming a plurality of core contact points on the core and coupling the package to the core comprises coupling the second plurality of contact points of the package to the plurality of core contact points.
5. The method of claim 1 , wherein the package has a sidewall, and wherein the entire sidewall of the package is embedded in the build-up section.
6. The method of claim 1 , wherein each of the first side and the second side of the package are embedded in the build-up section.
7. The method of claim 1 , wherein coupling the package to the printed circuit board further comprises coupling at least one of the first plurality of contact points to a layer of conductive material of the core.
8. The method of claim 7 , further comprising, on a surface of the printed circuit board, coupling an auxiliary device to the package through at least ones of the first plurality of contact points of the package.