Method for treating a substrate with a shock wave
Disclosed is an apparatus and method for treating a substrate. The method includes supplying cleaning particles to the substrate to clean the substrate. The cleaning particles are solid particles. The solid particles provide a shock wave to the substrate.
1. A method for treating a substrate, the method comprising:
supplying a treating solution onto the substrate;
supplying cleaning particles, the cleaning particles being solid particles;
changing the cleaning particles into fine solid particles by passing through a discharge structure; and
supplying the fine solid particles onto the treating solution to provide a shock wave at the treating solution to clean the substrate.
2. The method of claim 1 , wherein the fine solid particles are formed of a material soluble in the treating solution.
3. The method of claim 1 , wherein the fine solid particles are formed of a material with a specific gravity of 1 or less.
4. The method of claim 1 , wherein the fine solid particles are formed of a plastic powder.
5. The method of claim 1 , wherein the fine solid particles are supplied to the substrate by a carrier gas.
6. The method of claim 5 , wherein the carrier gas is a helium gas.
7. The method of claim 1 , wherein a state of the fine solid particles changes into a liquid state or a gas state at room temperature.
8. The method of claim 7 , wherein the solid particles are formed of dry-ice.