Chip-scale electrothermal analysis
View Patent ↗Various aspects of the disclosed technology relate to techniques of determining an across-chip distribution of temperature generated by on-chip devices. Effective thermal conductance and effective thermal capacity for each region of a plurality of regions of a layout design are first extracted. The effective thermal conductance for a region in a metal layer is determined based at least on density information of metal interconnect lines within the region and has components associated with directions of the metal interconnect lines. A thermal circuit is then constructed based on the effective thermal conductance, the effective thermal capacity and heat information of thermal nodes. The heat information of thermal nodes is determined based on an electrical simulation on the integrated circuit associated with the layout design. A thermal simulation is then performed on the thermal circuit to determine temperature information of the thermal nodes.
1. One or more non-transitory computer-readable media storing computer-executable instructions for causing one or more processors to perform a method, the method comprising:
extracting effective thermal conductance and effective thermal capacity for each region of a plurality of regions of a layout design, the layout design corresponding to at least a portion of an integrated circuit, and the effective thermal conductance for a region in a metal layer being determined based at least on density information of metal interconnect lines within the region and having components dependent on directions of the metal interconnect lines;
constructing a thermal circuit based on the effective thermal conductance, the effective thermal capacity, and heat information of thermal nodes, the heat information of thermal nodes determined based on an electrical simulation on the integrated circuit; and
performing a thermal simulation on the thermal circuit to determine temperature information of the thermal nodes;
wherein the effective thermal capacity is determined based on mechanical property information, the mechanical property information comprising Young's modulus, Poisson factors, thermal expansion coefficients, or any combination thereof.
2. The one or more non-transitory computer-readable media recited in claim 1 , wherein the extracting is further based on density information of vias on via layer(s) within the each region.
3. The one or more non-transitory computer-readable media recited in claim 1 , wherein the method further comprises:
performing another electrical simulation on the integrated circuit based on the temperature information to determine new heat information; and
performing another thermal simulation on the thermal circuit modified based on the new heat information to determine new temperature information.
4. The one or more non-transitory computer-readable media recited in claim 3 , wherein the method further comprises:
repeating the performing another electrical simulation by replacing the temperature information with the new temperature information and the performing another thermal simulation until one of one or more predetermined conditions is met.
5. A method, comprising:
extracting, using a computer, effective thermal conductance and effective thermal capacity for each region of a plurality of regions of a layout design, the layout design corresponding to at least a portion of an integrated circuit, and the effective thermal conductance for a region in a metal layer being determined based at least on density information of metal interconnect lines within the region and having components dependent on directions of the metal interconnect lines;
constructing, using the computer, a thermal circuit based on the effective thermal conductance, the effective thermal capacity, and heat information of thermal nodes, the heat information of thermal nodes determined based on an electrical simulation on the integrated circuit; and
performing, using the computer, a thermal simulation on the thermal circuit to determine temperature information of the thermal nodes;
wherein the effective thermal capacity is determined based on mechanical property information, the mechanical property information comprising Young's modulus, Poisson factors, thermal expansion coefficients, or any combination thereof.
6. The method recited in claim 5 , wherein the extracting is further based on density information of vias on via layer(s) within the each region.
7. The method recited in claim 5 , further comprising:
performing another electrical simulation on the integrated circuit based on the temperature information to determine new heat information; and
performing another thermal simulation on the thermal circuit modified based on the new heat information to determine new temperature information.
8. The method recited in claim 7 , further comprising:
repeating the performing another electrical simulation by replacing the temperature information with the new temperature information and the performing another thermal simulation until one of one or more predetermined conditions is met.
9. A system comprising:
one or more processors, the one or more processors programmed to perform a method, the method comprising:
extracting effective thermal conductance and effective thermal capacity for each region of a plurality of regions of a layout design, the layout design corresponding to at least a portion of an integrated circuit, and the effective thermal conductance for a region in a metal layer being determined based at least on density information of metal interconnect lines within the region and having components dependent on directions of the metal interconnect lines;
constructing a thermal circuit based on the effective thermal conductance, the effective thermal capacity, and heat information of thermal nodes, the heat information of thermal nodes determined based on an electrical simulation on the integrated circuit; and
performing a thermal simulation on the thermal circuit to determine temperature information of the thermal nodes;
wherein the effective thermal capacity is determined based on mechanical property information, the mechanical property information comprising Young's modulus, Poisson factors, thermal expansion coefficients, or any combination thereof.
10. The system recited in claim 9 , wherein the extracting is further based on density information of vias on via layer(s) within the each region.
11. The system recited in claim 9 , wherein the method further comprises:
performing another electrical simulation on the integrated circuit based on the temperature information to determine new heat information; and
performing another thermal simulation on the thermal circuit modified based on the new heat information to determine new temperature information.
12. The system recited in claim 11 , wherein the method further comprises:
repeating the performing another electrical simulation by replacing the temperature information with the new temperature information and the performing another thermal simulation until one of one or more predetermined conditions is met.