Light emitting module and illumination system including the same
A light emitting module is disclosed. The light emitting module includes a circuit board, a plurality of light emitting devices mounted on the circuit board and spaced apart from each other, molding parts wrapping the respective light emitting devices, and a reflective member disposed on the circuit board to surround the light emitting devices. The reflective member has a height greater than that of each of the molding parts. The reflective member has a plurality of openings exposing the light emitting devices, and each of the openings has a reflective side wall extending upward from the circuit board.
1. A light emitting module comprising:
a board;
a light emitting device disposed on the board;
a molding part disposed on the board and molded around the light emitting device;
a reflective member disposed on the board; and
a molding fixing part disposed on the board and contacting outer circumference of the molding part,
wherein the reflective member has an opening and a reflective side wall, and
wherein the reflective side wall is spaced apart from the molding part and the molding fixing part are spaced apart from the light emitting device; wherein the board comprises: a heat dissipation layer; a dielectric layer disposed on one surface of the heat dissipation layer; and a first conductive layer and a second conductive layer disposed on the dielectric layer.
2. The light emitting module according to claim 1 , wherein the molding fixing part has a circular or oval side wall to fix the outer circumference of the molding part.
3. The light emitting module according to claim 1 , wherein the board further comprises a solder resist layer disposed on the dielectric layer and at least a portion of the solder resist layer is interposed between the first conductive layer and the second conductive layer.
4. The light emitting module according to claim 1 , wherein the molding part includes a fluorescent substance.
5. The light emitting module according to claim 1 , wherein the molding part is formed in the shape of a dome covering the light emitting device.
6. The light emitting module according to claim 1 , wherein a height of the molding fixing part with respect to a top surface of the board is equal to or less than that of the molding part.
7. The light emitting module according to claim 1 , further comprising a fixing member positioned between the board and the reflective member.
8. The light emitting module according to claim 1 , further comprising reflective coating layer disposed on the reflective side wall.
9. The light emitting module according to claim 1 , wherein an uppermost surface of the reflective member is higher than an uppermost surface of the molding part.
10. The light emitting module according to claim 1 , wherein a portion of the reflective side wall overlaps with the molding part in the vertical direction.
11. The light emitting module according to claim 10 , wherein an upper end of the reflective side wall has a protrusion overlapping with the molding part in a vertical direction.
12. The light emitting module according to claim 11 , wherein the protrusion of the reflective side wall overlaps with the molding fixing part in a vertical direction.
13. The light emitting module according to claim 10 , wherein an upper end of the reflective side wall and a lower end of the reflective side wall have different tilts with respect to the board.
14. The light emitting module according to claim 1 , further comprising at least one wire electrically connecting the light emitting device to the first conductive layer and the second conductive layer.
15. The light emitting module according to claim 1 , wherein the reflective member comprises a plurality of layers.
16. The light emitting module according to claim 1 , wherein the light emitting device includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer.
17. The light emitting module according to claim 1 , wherein a portion of the molding part is disposed between the light emitting device and the molding fixing part.
18. A light emitting module comprising:
a board;
a light emitting device disposed on the board;
a molding fixing part disposed on the board and having a side wall on the board;
a molding part disposed inside the side wall of the molding fixing part on the board and molded around the light emitting device; and
a reflective member disposed on the board,
wherein the reflective member has an opening and a reflective side wall and,
wherein the reflective side wall is spaced apart from the molding fixing part and,
wherein a portion of the molding part is disposed between the light emitting device and the side wall of the molding fixing part; wherein the board comprises: a heat dissipation layer; a dielectric layer disposed on one surface of the heat dissipation layer; and a first conductive layer and a second conductive layer disposed on the dielectric layer.
19. An illumination system comprising:
a bottom cover;
a reflective plate disposed on the bottom cover;
a light guide plate disposed on the reflective plate;
a light emitting module emitting light to the incidence surface;
an optical sheet disposed on the light guide plate; and
a display panel disposed on the optical sheet, wherein the light emitting module comprises:
a board;
a light emitting device disposed on the board;
a molding part disposed on the board and molded around the light emitting device;
a reflective member disposed on the board; and
a molding fixing part disposed on the board and contacting outer circumference of the molding part,
wherein the reflective member has an opening and a reflective side wall, and
wherein the reflective side wall is spaced apart from the molding part and the molding fixing part are spaced apart from the light emitting device; wherein the board comprises: a heat dissipation layer; a dielectric layer disposed on one surface of the heat dissipation layer; and a first conductive layer and a second conductive layer disposed on the dielectric layer.