Dry film and printed wiring board
An object of the present invention is to provide: a dry film comprising a resin layer which has excellent detachability from a carrier film and in which cracking and powdering are inhibited; and a printed wiring board comprising a cured article obtained by curing the dry film. The dry film comprises a resin layer containing a thermosetting resin component, a filler and at least two solvents, wherein the at least two solvents both have a boiling point of 100° C. or higher and the boiling points of the at least two solvents are different by not less than 5° C.
1. A dry film, comprising:
a resin layer comprising a thermosetting resin component, a filler and a plurality of solvents,
wherein the solvents each have a boiling point of 100° C. or higher, the solvents have boiling points which are different by not less than 5° C., and the solvents are ones selected from the group consisting of toluene, cyclohexanone, and an aromatic hydrocarbon having 8 or more carbon atoms.
2. The dry film according to claim 1 , wherein the solvents comprise toluene and cyclohexanone.
3. The dry film according to claim 1 , wherein the filler is included in an amount of 30 to 80% by weight based on a total amount of the dry film excluding the solvents.
4. The dry film according to claim 1 , wherein the thermosetting resin component comprises an epoxy compound, and the resin layer further includes a curing agent.
5. A printed wiring board, comprising:
a cured article obtained by a process including curing the resin layer of the dry film according to claim 1 .
6. A printed wiring board, comprising:
a cured article obtained by a process including curing the resin layer of the dry film according to claim 2 .
7. A printed wiring board, comprising:
a cured article obtained by a process including curing the resin layer of the dry film according to claim 3 .
8. A printed wiring board, comprising:
a cured article obtained by a process including curing the resin layer of the dry film according to claim 4 .
9. The dry film according to claim 1 , wherein the resin layer includes the solvents in an amount of 0.1 to 4% by weight based on a total amount of the resin layer of the dry film including the solvents.
10. The dry film according to claim 1 , wherein the resin layer includes the solvents in an amount of 0.3 to 3% by weight based on a total amount of the resin layer of the dry film including the solvents.
11. The dry film according to claim 2 , wherein the resin layer includes the solvents in an amount of 0.1 to 4% by weight based on a total amount of the resin layer of the dry film including the solvents.
12. The dry film according to claim 2 , wherein the resin layer includes the solvents in an amount of 0.3 to 3% by weight based on a total amount of the resin layer of the dry film including the solvents.
13. The dry film according to claim 3 , wherein the resin layer includes the solvents in an amount of 0.1 to 4% by weight based on a total amount of the resin layer of the dry film including the solvents.
14. The dry film according to claim 3 , wherein the resin layer includes the solvents in an amount of 0.3 to 3% by weight based on a total amount of the resin layer of the dry film including the solvents.
15. The dry film according to claim 4 , wherein the resin layer includes the solvents in an amount of 0.1 to 4% by weight based on a total amount of the resin layer of the dry film including the solvents.
16. The dry film according to claim 4 , wherein the resin layer includes the solvents in an amount of 0.3 to 3% by weight based on a total amount of the resin layer of the dry film including the solvents.
17. The dry film according to claim 4 , wherein the epoxy compound comprises at least one solid epoxy resin.
18. The dry film according to claim 4 , wherein the epoxy compound comprises at least one of a solid epoxy resin and a semi-solid epoxy resin.
19. The dry film according to claim 4 , wherein the epoxy compound comprises at least one solid epoxy resin and at least one semi-solid epoxy resin.