Structure and method for manufacture of memory device with thin silicon body
View Patent ↗Described herein is a structure and method of manufacturing for a memory device with a thin silicon body. The memory device may be a semiconductor comprising: a first dielectric of a first width; a second dielectric of a second width, the second width less than the first width; and a thin film polycrystalline silicon (poly-Si) on sidewalls of the second dielectric.
1. A method for forming a first memory stack in fabrication of a nonvolatile memory device, the method comprising:
depositing a first dielectric layer above an upper surface of a semiconductor substrate;
depositing a second dielectric layer of a material different from the first dielectric layer above the first dielectric layer;
carrying out anisotropic etching of the second dielectric layer and the first dielectric layer sequentially, so as to create a first dielectric pattern and a second dielectric pattern above the first dielectric pattern;
carrying out isotropic etching of the first and second dielectric patterns, and the isotropic etching for the first dielectric pattern is at a higher etch rate than the isotropic etching for the second dielectric layer, and the isotropic etching removing at least a portion of the first dielectric pattern and forming at least one undercut space under the second dielectric pattern;
depositing a first film of a conducting or a semiconducting material at least on a sidewall of the second dielectric pattern and in the at least one undercut space;
carrying out dry etching in a manner so as to remove the first film from the sidewall of the second dielectric pattern and to leave the first film in the at least one undercut space;
depositing a third dielectric layer over at least a sidewall of the first film; and
depositing a second film of a conducting or a semiconducting material over the third dielectric layer, so that a topmost portion of the second film is at a location higher than a topmost portion of the second dielectric pattern and a bottom-most portion of the second film is at a lower location that the first film.
2. The method of claim 1 , wherein a second memory stack adjacent to the first memory stack is formed at same actions as for forming of the first memory stack, and the second memory stack having a structure at least substantially identical to the first memory stack.
3. The method of claim 2 , wherein the second film is deposited to fill a space between the first and the second memory stack.
4. The method of claim 2 , wherein the carrying out of the isotropic etching does not remove the first dielectric pattern entirely, so that a part of the first dielectric pattern remains under the second dielectric pattern after the carrying out of the isotropic etching.
5. The method of claim 2 , wherein the first film is comprised of polysilicon.
6. The method of claim 2 , wherein the first film extends continuously in a first direction horizontal to an upper surface of the semiconductor substrate.
7. The method of claim 2 , wherein the second film extends continuously in a second direction perpendicular to the first direction.
8. The method of claim 2 , wherein the first dielectric layer is made of a material with a dielectric constant lower than a dielectric constant of the second dielectric layer.
9. The method of claim 8 , wherein the first dielectric layer is made of silicon oxide, and the second dielectric layer is made of silicon nitride.
10. The method of claim 2 , wherein before the depositing of the first film:
i) a third dielectric pattern is formed on the second dielectric pattern; and
ii) a fourth dielectric pattern is formed on the third dielectric pattern, and the third dielectric pattern being of a same material as the first dielectric pattern, and the fourth dielectric pattern being of a same material as the second dielectric pattern.
11. The method of claim 2 , wherein the first film left in the at least one undercut space has a thickness in a direction parallel to the upper surface of the semiconductor substrate which is smaller than a height in a direction perpendicular to the upper surface of the semiconductor substrate.
12. The method of claim 1 , wherein the carrying out of the isotropic etching does not remove the first dielectric pattern entirely, so that a part of the first dielectric pattern remains under the second dielectric pattern after the carrying out of the isotropic etching.
13. The method of claim 1 , wherein the first film is comprised of polysilicon.
14. The method of claim 1 , wherein the first film extends continuously in a first direction horizontal to an upper surface of the semiconductor substrate.
15. The method of claim 1 , wherein the second film extends continuously in a second direction perpendicular to the first direction.
16. The method of claim 1 , wherein the first dielectric layer is made of a material with a dielectric constant lower than a dielectric constant of the second dielectric layer.
17. The method of claim 16 , wherein the first dielectric layer is made of silicon oxide, and the second dielectric layer is made of silicon nitride.
18. The method of claim 1 , wherein before the depositing of the first film:
i) a third dielectric pattern is formed on the second dielectric pattern; and
ii) a fourth dielectric pattern is formed on the third dielectric pattern, and the third dielectric pattern being of a same material as the first dielectric pattern, and the fourth dielectric pattern being of a same material as the second dielectric pattern.
19. The method of claim 1 , wherein the first film left in the at least one undercut space has a thickness in a direction parallel to the upper surface of the semiconductor substrate which is smaller than a height in a direction perpendicular to the upper surface of the semiconductor substrate.