IP Library Granted Patent US 9,391,298
Granted Patent B2
US 9,391,298 · App. 14/938,659 · Granted Jul 12, 2016

Organic light emitting display apparatus encapsulated with hydrophobic organic film and manufacturing method thereof

Inventor: Zaifeng Xie (Shanghai, CN)
Assignees: Shanghai Tianma AM-OLED Co., Ltd.; Tianma Micro-Electronics Co., Ltd.
H01L51/5253H01L51/5256H01L51/56H01L51/0034H01L51/0094H01L2251/558
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Quick Facts
Patent No.
US 9,391,298
App. No.
14/938,659
Granted
Jul 12, 2016
Kind
B2
Abstract

An organic light emitting display apparatus is disclosed. The display apparatus includes a substrate, an organic light emitting unit on the substrate, and a film encapsulation layer on the organic light emitting unit. The film encapsulation layer includes a hydrophobic organic layer disposed at an outermost portion of the film encapsulation layer.

Claims (24)

1. A method for manufacturing an organic light emitting display apparatus, comprising:

providing a substrate;

forming an organic light emitting unit on the substrate; and

forming a film encapsulation layer covering the organic light emitting unit,

wherein forming the film encapsulation layer comprises:

forming at least a hydrophobic organic layer covering the organic light emitting unit with a plasma enhanced chemical vapor deposition method, wherein the film encapsulation layer comprises the hydrophobic organic layer, and wherein the hydrophobic organic layer is disposed at an outermost portion of the film encapsulation layer,

wherein the hydrophobic organic layer comprises a fluorinated hybrid polymer organic film, and the fluorinated hybrid polymer organic film comprises, in atomic percent, 10 at % to 50 at % of fluorine atom F, 1 at % to 30 at % of silicon atom Si, 1 at % to 30 at % of oxygen atom 0, and 15 at % to 50 at % of carbon atom C.

2. The method for manufacturing the organic light emitting display apparatus according to claim 1 , where forming the film encapsulation layer comprises:

forming an inorganic blocking layer covering the organic light emitting unit with an atomic layer deposition method, a plasma enhanced chemical vapor deposition method, or a physical vapor deposition method; and

forming the hydrophobic organic layer covering the inorganic blocking layer with a plasma enhanced chemical vapor deposition method.

3. The method for manufacturing the organic light emitting display apparatus according to claim 2 , further comprising:

alternately forming hydrophobic organic layers and inorganic blocking layers M times, wherein 0<M<10, and M is a positive integer.

4. The method for manufacturing the organic light emitting display apparatus according to claim 1 , wherein a contact angle between the hydrophobic organic layer and water ranges from 90° to 170°.

5. The method for manufacturing the organic light emitting display apparatus according to claim 1 , wherein a contact angle between the hydrophobic organic layer and water ranges from 110° to 160°.

6. The method for manufacturing the organic light emitting display apparatus according to claim 1 , wherein the hydrophobic organic layer is made from a precursor comprising fluorinated silane and silane.

7. The method for manufacturing the organic light emitting display apparatus according to claim 6 , wherein the hydrophobic organic layer is made from a precursor comprising heptadecafluorodecyl trimethoxysilane and tetramethoxysilane.

8. The method for manufacturing the organic light emitting display apparatus according to claim 2 , wherein the inorganic blocking layer comprises one or more of a metal oxide, a metal nitride, a silicon oxide, and a silicon nitride.

9. The method for manufacturing the organic light emitting display apparatus according to claim 2 , further comprising:

alternately forming hydrophobic organic layers and inorganic blocking layers M times, wherein 0<M<5, and M is a positive integer.

10. The method for manufacturing the organic light emitting display apparatus according to claim 1 , wherein the formed hydrophobic organic layer has a thickness in a range of 500 nm to 3000 nm.

11. The method for manufacturing the organic light emitting display apparatus according to claim 2 , wherein the formed inorganic blocking layer has a thickness in a range of 300 nm to 1000 nm.

12. The method for manufacturing the organic light emitting display apparatus according to claim 2 , wherein formed the film encapsulation layer has a thickness in a range of 0.5 μm to 10 μm.

13. The method for manufacturing the organic light emitting display apparatus according to claim 2 , wherein the formed hydrophobic organic layer has a thickness larger than that of the formed inorganic blocking layer.

14. The method for manufacturing the organic light emitting display apparatus according to claim 1 , wherein the formed hydrophobic organic layer comprising hydrophobic organic material having C—F bond, Si—C bond, Si—O—Si bonds and C—H bond.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 7, 2022
From: SHANGHAI TIANMA AM-OLED CO.,LTD.; TIANMA MICRO-ELECTRONICS CO., LTD.
To: WUHAN TIANMA MICRO-ELECTRONICS CO., LTD.; WUHAN TIANMA MICROELECTRONICS CO., LTD.SHANGHAI BRANCH; TIANMA MICRO-ELECTRONICS CO., LTD.
Reel/Frame 059619/0730 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 19, 2016
From: XIE, ZAIFENG
To: SHANGHAI TIANMA AM-OLED CO., LTD.; TIANMA MICRO-ELECTRONICS CO., LTD.
Reel/Frame 038652/0966 →
Priority Claims (1)
CN 2013 1 0697551 · Dec 18, 2013 · national
Continuity (2)
Division 14463569 · Aug 19, 2014
Related Publication 20160064689A1 · Mar 3, 2016