IP Library Granted Patent US 9,779,839
Granted Patent B2
US 9,779,839 · App. 14/940,327 · Granted Oct 3, 2017

Methods for providing redundancy in a memory array comprising mapping portions of data associated with a defective address

Inventors: Violante Moschiano (Avezzano, IT); Giovanni Santin (Rieti, IT); Maria-Luisa Gallese (Avezzano, IT); Luigi Pilolli (L'Aquila, IT)
Assignee: Micron Technology, Inc.
G11C29/846G11C16/0483G11C29/76G11C29/82G11C2229/723
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,779,839
App. No.
14/940,327
Granted
Oct 3, 2017
Kind
B2
Abstract

Methods for providing redundancy in a memory include mapping a portion of first data associated with an address of the memory determined to indicate a defective memory cell to an address of a redundant area of the memory array, and writing second data to the memory array, wherein a portion of the second data is written to a column of the memory array associated with the address of the memory determined to indicate a defective memory cell for the first data.

Claims (31)

1. A method for providing redundancy in a memory having a memory array, wherein one or more addresses of the memory array have been determined to indicate a defective memory cell, the method comprising:

inputting first data from I/O connections for a first programming operation;

mapping a portion of the first data associated with an address of the memory determined to indicate a defective memory cell to an address of a redundant area of the memory array;

inputting second data from the I/O connections for a second programming operation; and

writing the second data to the memory array, wherein a portion of the second data is written to a column of the memory array associated with the address of the memory determined to indicate a defective memory cell for the first data.

2. The method of claim 1 , wherein the portion of the second data is written to more than one column of the memory array associated with the address of the memory determined to indicate a defective memory cell for the first data.

3. The method of claim 1 , wherein inputting the second data comprises inputting the second data associated with an address of the memory determined to indicate a defective memory cell, the method further comprising:

mapping a second portion of the second data associated with the address of the memory determined to indicate a defective memory cell for the second data to an address of the redundant area of the memory array.

4. The method of claim 1 , wherein inputting the first data from the I/O connections further comprises loading the first data into a buffer and wherein inputting the second data from the I/O connections further comprises loading the second data into the buffer.

5. The method of claim 4 , wherein inputting the first data from the I/O connections further comprises generating addresses of the buffer for the first data input from the I/O connections, and wherein inputting the second data from the I/O connections further comprises generating addresses of the buffer for the second data input from the I/O connections.

6. A method for providing redundancy in a memory, wherein the memory has a memory array and one or more addresses of the memory array have been determined to indicate a defective memory cell, the method comprising:

inputting first data from I/O connections of the memory, and loading the first data for programming into a row of the memory array for a first programming operation;

writing the first data to the memory array, including mapping a portion of the first data associated with an address of the memory array determined to indicate a defective memory cell of a particular column of the memory array to an address of a redundant area of the memory array;

inputting second data from the I/O connections of the memory, and loading the second data for programming into a different row of the memory array for a second programming operation; and

writing the second data to the memory array, including mapping a portion of the second data associated with an address of the memory array determined to indicate a defective memory cell of a different column of the memory array to an address of a redundant area of the memory array, and without mapping any portion of the second data associated with an address of the memory array of the particular column of the memory array to an address of a redundant area of the memory array, such that a portion of the second data is written to the particular column of the memory array.

7. The method of claim 6 , wherein the data is mapped on a bit-by-bit basis.

8. The method of claim 6 , wherein the data is mapped on a byte-by-byte basis.

9. The method of claim 6 , wherein loading the first data for programming comprises loading the first data into a buffer prior to writing any portion of the first data, and wherein loading the second data for programming comprises loading the second data into a buffer prior to writing any portion of the second data.

10. The method of claim 9 , wherein mapping comprises copying or moving data from an address of the buffer to a different address of the buffer.

11. A method for providing redundancy in a memory having a memory array, wherein a plurality of addresses of the memory array have been determined to indicate a defective memory cell, the method comprising:

inputting first data from I/O connections for a first programming operation;

mapping each portion of the first data associated with a respective address of the memory determined to indicate a defective memory cell to a respective address of a redundant area of the memory array;

inputting second data from the I/O connections for a second programming operation; and

writing the second data to the memory array, wherein portions of the second data are each written to a respective column of the memory array associated with the address of the memory determined to indicate a defective memory cell for its respective portion of the first data.

12. The method of claim 11 , wherein inputting the second data comprises inputting the second data having a particular portion associated with an address of the memory determined to indicate a defective memory cell, the method further comprising:

mapping the particular portion of the second data associated with the address of the memory determined to indicate a defective memory cell for the second data to an address of the redundant area of the memory array.

13. The method of claim 11 , wherein inputting the first data from the I/O connections further comprises loading the first data into a buffer, and wherein inputting the second data from the I/O connections further comprises loading the second data into the buffer.

14. The method of claim 13 , wherein inputting the first data from the I/O connections further comprises generating addresses of the buffer for the first data input from the I/O connections, and wherein inputting the second data from the I/O connections further comprises generating addresses of the buffer for the second data input from the I/O connections.

15. The method of claim 1 , further comprising performing a program verify after writing the second data to the memory array.

16. The method of claim 1 , further comprising writing the first data to the memory array after mapping the portion of the first data associated with the address of the memory determined to indicate a defective memory cell to the address of the redundant area of the memory array.

17. The method of claim 4 , further comprising writing the second data from the buffer to the memory array.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
Continuity (2)
Continuation 13208502 · Aug 12, 2011
Related Publication 20160071619A1 · Mar 10, 2016