Thin film transistor, method for manufacturing the same, and semiconductor device
In a thin film transistor, an increase in off current or negative shift of the threshold voltage is prevented. In the thin film transistor, a buffer layer is provided between an oxide semiconductor layer and each of a source electrode layer and a drain electrode layer. The buffer layer includes a metal oxide layer which is an insulator or a semiconductor over a middle portion of the oxide semiconductor layer. The metal oxide layer functions as a protective layer for suppressing incorporation of impurities into the oxide semiconductor layer. Therefore, in the thin film transistor, an increase in off current or negative shift of the threshold voltage can be prevented.
1. A semiconductor device comprising:
a gate electrode over a substrate;
a gate insulating layer over the gate electrode;
an oxide semiconductor layer over the gate insulating layer; and
a conductive layer electrically connected to the oxide semiconductor layer,
wherein the oxide semiconductor layer includes a first region and a second region,
wherein the conductive layer includes a third region and a fourth region,
wherein the second region is closer to the conductive layer than the first region, and the third region is closer to the oxide semiconductor layer than the fourth region, and
wherein the second region has a lower oxygen concentration than the first region, and the third region has a higher oxygen concentration than the fourth region.
2. A semiconductor device comprising:
a gate electrode containing copper over a substrate;
a gate insulating layer over the gate electrode;
an oxide semiconductor layer over the gate insulating layer; and
a conductive layer containing titanium electrically connected to the oxide semiconductor layer,
wherein the oxide semiconductor layer includes a first region and a second region,
wherein the conductive layer includes a third region and a fourth region,
wherein the second region is closer to the conductive layer than the first region, and the third region is closer to the oxide semiconductor layer than the fourth region, and
wherein the second region has a lower oxygen concentration than the first region, and the third region has a higher oxygen concentration than the fourth region.
3. The semiconductor device according to claim 2 , wherein the gate electrode further contains titanium.
4. The semiconductor device according to claim 2 , wherein the conductive layer further contains copper.