IP Library › Granted Patent US 10,198,047
Granted Patent B2
US 10,198,047 · App. 14/946,440 · Granted Feb 5, 2019

Data storage device connector with integrated temperature sensor

Inventors: Robert B. Curtis (Georgetown, TX); Chris E. Peterson (Austin, TX); Bernard D. Strmiska (Round Rock, TX)
Assignee: Dell Products, LP
G06F1/206G01K1/14G06F1/187
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Quick Facts
Patent No.
US 10,198,047
App. No.
14/946,440
Filed
Nov 19, 2015
Granted
Feb 5, 2019
Kind
B2
Art Unit
2896
USPC
700/300
Abstract

An information handling system includes an electrical connector to mate with terminals of a data storage device. The system further includes a temperature sensor integrated at the electrical connector. The temperature sensor is arranged to thermally couple to an exterior surface of the data storage device when the data storage device is fully inserted into the electrical connector.

Claims (36)

1. An information handling system comprising:

an enclosure including a chassis component to physically secure a data storage device, the enclosure including a backplane;

an electrical connector physically attached to the backplane and configured to mate with terminals of a data storage device to couple electrical signals from the terminals to the backplane; and

a temperature sensor integrated at the electrical connector, the temperature sensor arranged to thermally couple to an exterior surface of the data storage device when the data storage device is fully inserted into the electrical connector.

2. The system of claim 1 , wherein the temperature sensor is in direct physical contact with the data storage device when the data storage device is fully inserted into the electrical connector.

3. The system of claim 2 , wherein the temperature sensor is coupled to the electrical connector via a resilient material that is compressed when the data storage device is fully inserted into the electrical connector.

4. The system of claim 2 , wherein signal leads of the temperature sensor are routed through the electrical connector and adapted to interface to the backplane in the same manner as signal leads corresponding to the data storage device.

5. The system of claim 1 , further comprising:

a cooling fan; and

a service processor configured to operate out-of-band with respect to a primary central processing unit at the information handling system, the service processor coupled to the cooling fan and to the temperature sensor, the service processor to acquire temperature information corresponding to the data storage device from the temperature sensor and regulate operation of the cooling fan based on the temperature information.

6. The system of claim 1 , wherein temperature information corresponding to the data storage device is acquired from the temperature sensor without interrupting data accesses at the data storage device.

7. The system of claim 1 , wherein the temperature sensor is located within a molded body of the electrical connector, the temperature sensor thermally coupled to the data storage device by a spring-loaded thermally conductive conduit.

8. The system of claim 1 , wherein the electrical connector is an interposer to couple the data storage device to a second electrical connector attached to the chassis component of the information handling system, and wherein signals provided by the temperature sensor are propagated through the interposer to the second electrical connector.

9. The system of claim 1 , further comprising:

an electronic component to aggregate temperature information received from a plurality of temperature sensors including the temperature sensor.

10. An electrical connector comprising:

signal conductors to communicate signals from terminals of a data storage device to a backplane at an information handling system enclosure, the enclosure including a chassis component to physically secure the data storage device at the information handling system; and

a temperature sensor integrated at the electrical connector and arranged to thermally couple to an exterior surface of the data storage device when the data storage device is fully inserted into the electrical connector,

wherein the electrical connector is physically attached to the backplane.

11. The connector of claim 10 , wherein the temperature sensor is in direct physical contact with the data storage device when the data storage device is fully inserted into the electrical connector.

12. The connector of claim 11 , wherein the temperature sensor is coupled to the electrical connector via a resilient material that is compressed when the data storage device when the data storage device is fully inserted into the electrical connector.

13. The connector of claim 11 , wherein temperature information corresponding to the data storage device is acquired from the temperature sensor without interrupting data accesses at the data storage device, the temperature information further providing an indication that an operational data storage device is presently inserted at the electrical connector.

14. The connector of claim 10 , wherein signal leads of the temperature sensor are adapted to interface to the backplane in the same manner as the signal conductors corresponding to the data storage device.

15. The connector of claim 10 , wherein:

the temperature sensor is located within a molded body of the electrical connector, the temperature sensor thermally coupled to the data storage device by a thermally conductive conduit; and

signal leads of the temperature sensor are adapted to interface to the backplane in the same manner as signal leads corresponding to the data storage device.

16. The connector of claim 10 , wherein the electrical connector is an interposer to couple the data storage device to a second electrical connector attached to the chassis component of the information handling system, and wherein signals provided by the temperature sensor are propagated through the interposer to the second electrical connector.

17. A data storage enclosure comprising:

a chassis component to physically secure a first data storage device at the enclosure;

a backplane; and

a first electrical connector physically attached to the backplane and configured to communicate signals from terminals of the data storage device to the backplane, the first electrical connector including a first temperature sensor integrated at the first electrical connector, the first temperature sensor arranged to thermally couple to an exterior surface of a first data storage device when the first data storage device is fully inserted into the first electrical connector.

18. The enclosure of claim 17 , further comprising:

a second electrical connector to interface a second data storage device to the backplane, the second electrical connector comprising a second temperature sensor integrated at the electrical connector, the second temperature sensor arranged to thermally couple to an exterior surface of a second data storage device when the second data storage device is fully inserted into the second electrical connector; and

a thermal management device to aggregate temperature information received from the first temperature sensor and from the second temperature sensor.

19. The enclosure of claim 17 , wherein the temperature sensor is in direct physical contact with the data storage device when the data storage device is fully inserted into the electrical connector.

20. The enclosure of claim 17 , wherein temperature information corresponding to the data storage device is acquired from the temperature sensor without interrupting data accesses at the data storage device.

Assignments (17)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (050724/0466) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO WYSE TECHNOLOGY L.L.C.)
Reel/Frame 060753/0486 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (045455/0001) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061753/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (040136/0001) Recorded Apr 26, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061324/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 3, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL, L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058216/0001 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Oct 15, 2019
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 050724/0466 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 040134/0001 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 040136/0001 →
RELEASE OF REEL 037848 FRAME 0001 (TL) Recorded Sep 14, 2016
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: DELL SOFTWARE INC.; DELL PRODUCTS L.P.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040028/0152 →
RELEASE OF REEL 037848 FRAME 0210 (NOTE) Recorded Sep 14, 2016
From: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: DELL SOFTWARE INC.; DELL PRODUCTS L.P.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040031/0725 →
RELEASE OF REEL 037847 FRAME 0843 (ABL) Recorded Sep 13, 2016
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: DELL SOFTWARE INC.; DELL PRODUCTS L.P.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040017/0366 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 4, 2016
From: CURTIS, ROBERT B.; PETERSON, CHRIS E.; STRMISKA, BERNARD D.
To: DELL PRODUCTS, LP
Reel/Frame 038008/0448 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (TERM LOAN) Recorded Feb 18, 2016
From: DELL SOFTWARE INC.; DELL PRODUCTS L.P.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037848/0001 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (ABL) Recorded Feb 18, 2016
From: DELL SOFTWARE INC.; DELL PRODUCTS L.P.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 037847/0843 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (NOTES) Recorded Feb 18, 2016
From: DELL SOFTWARE INC.; DELL PRODUCTS L.P.; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 037848/0210 →
Continuity (1)
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