Through substrate via liner densification
View Patent ↗Apparatuses and methods are disclosed herein for densification of through substrate insulating liners. An example method may include forming a through substrate via through at least a portion of a substrate, forming a first liner layer in the through substrate via, and densifying the first liner layer. The example method may further include forming a second liner layer on the first liner layer, and densifying the second liner layer.
1. A method, comprising:
forming a through substrate via through at least a portion of a substrate;
forming, in a tool, a first liner layer in the through substrate via, the first liner layer being non-conductive;
etching the first liner layer;
before introducing reactive gases in the tool, densifying the first liner layer, wherein densifying the first liner layer comprises annealing the first liner layer:
cleaning the substrate and an etched first liner layer with water of etched particulates;
forming a second liner layer on the first liner layer and the cleaned substrate; and
before introducing additional reactive gases in the tool, densifying the second liner layer, wherein densifying the second liner layer comprises annealing the second liner layer.
2. The method of claim 1 , wherein the first liner layer is annealed at a temperature of about 300° C. to 500° C. in an inert atmosphere.
3. The method of claim 1 , wherein the reactive gases are introduced into the tool to form the second liner layer.
4. The method of claim 1 , wherein the second liner layer is annealed a temperature of about 300° C. to 500° C. in an inert atmosphere.
5. The method of claim 1 , herein the additional reactive gases are introduced into the tool to form a cap layer.
6. The method of claim 1 , further comprising:
forming a cap layer on the second liner layer; and
forming a conductor inside the through substrate via such that the first liner layer, the second liner layer, and the cap layer are disposed between the substrate and the conductor.
7. The method of claim 1 , further comprising:
forming a cap layer on the first liner layer; and
forming a conductor inside the through substrate via such that the first liner layer and the cap layer are disposed between the conductor and the substrate.
8. A method, comprising:
forming, in a tool, a first liner layer in a through substrate via formed in a substrate;
before introducing reactive gases in the tool for formation of a second liner layer, densifying the first liner layer;
etching the first liner layer to produce particulates of the first liner layer on the substrate;
before forming the second liner layer, rinsing with water the substrate to clean the substrate of the particulates of the first liner layer on the substrate;
forming the second liner layer over the first liner layer and the cleaned substrate;
before introducing additional reactive gases in the tool, densifying the second liner layer; and
forming an oxide cap layer over the second liner layer.
9. The method of claim 8 , further comprising:
forming a conductor over the oxide cap layer; and
removing portions of the first liner layer, the second liner layer, and the conductor from a top surface of the substrate.
10. The method of claim 8 , further comprising:
forming a chemical mechanical planarization layer stop layer on a top side of the substrate; and
forming the through substrate via at least partially through the substrate.
11. The method of claim 8 , wherein forming the first liner layer in the through substrate via formed in the substrate comprises depositing an oxide in the through substrate via in the substrate using a chemical vapor deposition ozone-tetraethylorthosilicate (TEOS) process.
12. The method of claim 8 , wherein forming the oxide cap layer over the second liner layer comprises depositing an oxide layer on the second liner layer using a plasma enhanced chemical vapor deposition TEOS process.
13. The method of claim 8 , wherein densifying the first liner layer comprises annealing the first liner layer at a temperature of 400° C.
14. The method of claim 8 , wherein etching the first liner layer to produce the particulates of the first liner layer on the substrate comprises:
dry etching portions of the first liner layer from the top side of the substrate.
15. The method of claim 8 , wherein forming, in the tool, the first liner layer in the through substrate via formed in the substrate comprises:
forming the through substrate via at least partially through the substrate; and
depositing the first liner layer in the through substrate via.
16. The method of claim 8 , further comprising:
annealing the second liner layer at a temperature of about 300° C. to 500° C.; and
wherein forming the oxide cap layer over the second liner layer comprises using a plasma enhanced chemical vapor deposition tetraethylorthosilicate (TEOS) process.
17. The method of claim 8 , wherein densifying the first liner layer comprises annealing the first liner layer to a temperature of about 300° C. to 500° C. in an inert atmosphere.
18. The method of claim 8 , wherein the first and second liner layers are both formed using a chemical vapor deposition ozone-tetraethylorthosilicate process.
19. The method of claim 8 , further comprising:
depositing a metal over the oxide cap layer;
annealing the metal; and
removing the metal, the oxide cap layer, the second liner layer, and the first liner layer using chemical mechanical planarization.
20. The method of claim 8 ,
wherein the second liner layer is a high step coverage liner layer.
21. The method of claim 8 , wherein densifying the second liner layer comprises:
before forming the oxide cap layer, annealing the second liner layer in the tool before introducing the additional reactive gases, wherein the additional reactive gases form the cap layer.
22. The method of claim 8 , wherein the second liner layer is formed using a sub atmospheric chemical vapor deposition ozone-tetraethylorthosilicate (O3/TEOS) process, and wherein the oxide cap layer is formed using a plasma enhanced chemical vapor deposition TEOS process.