Method for fabricating a carrier-less silicon interposer
View Patent ↗An insulating second element is provided and overlies a surface of a first element which consists essentially of a material having a CTE of less than 10 ppm/° C. and has a first thickness in a first direction normal to the surface. Openings extend in the first direction through the second element. The first element is abraded to produce a thinned first element having a second thickness less than the first thickness. Conductive elements are formed at a first side of the interposer coincident with or adjacent to a surface of the thinned first element remote from the second element. A conductive structure extends through the openings in the second element, wherein the conductive elements are electrically connected with terminals of the interposer through the conductive structure, and the terminals are disposed at a second side of the interposer opposite from the first side.
1. A method of fabricating an interposer, comprising:
providing an insulating second element overlying a surface of a first element, the first element consisting essentially of a material having a CTE of less than 10 ppm/° C., the first element having a first thickness in a first direction normal to the surface, wherein openings extend in the first direction through the second element;
and
forming conductive elements at a first side of the interposer at a surface of the first element remote from the second element, and a conductive structure extending through the openings in the second element, wherein the conductive elements are electrically connected with terminals of the interposer through the conductive structure, the terminals disposed at a second side of the interposer opposite from the first side,
wherein forming the conductive structure includes providing electrically conductive material at least within the openings in the second element, and forming a via extending within the first element in a first direction of a thickness of the first element to contact the conductive material.
2. The method of claim 1 , wherein the insulating second element is provided by molding a dielectric insulating layer onto the surface of the first element.
3. The method of claim 1 , wherein the providing the second element includes forming a structure of the first element with an in-process insulating element overlying the surface of the first element and then removing material from the in-process insulating element.
4. The method of claim 1 , wherein the second element is provided in a state in which an electrically conductive pad is disposed at the first surface of the first element and a metalized via coupled to the conductive pad extends within the first element in the first direction away from the surface of the first element, wherein at least one of the conductive elements is electrically coupled with at least one of the terminals through the metalized via.
5. The method of claim 1 , wherein the
via is a metalized via, and wherein the at least one of the conductive elements is electrically coupled with the at least one of the terminals through the metalized via.
6. The method of claim 2 , wherein at least portions of the openings in the second element are provided during the molding of the insulating layer.
7. The method of claim 4 , wherein the conductive pad is aligned at least partially with one of the openings in the second element.
8. The method of claim 5 , wherein the metalized via is connected with the conductive elements through one or more wiring layers formed in or on one or more dielectric layers of the first element.
9. The method of claim 7 , wherein the forming of the conductive structure includes at least one of depositing or flowing a conductive material within the opening onto the conductive pad.
10. The method of claim 8 , wherein the one or more dielectric layers of the first element are atop a surface of the first element.