IP Library › Granted Patent US 9,548,457
Granted Patent B2
US 9,548,457 · App. 14/950,613 · Granted Jan 17, 2017

Spirofluorene derivative, material for light-emitting element, light-emitting element, light-emitting device, and electronic device

Inventors: Sachiko Kawakami (Isehara, JP); Harue Nakashima (Atsugi, JP)
Assignee: Semiconductor Energy Laboratories Co., Ltd.
H01L51/006C07C211/61C07D209/86C07D209/88C09K11/06H01L51/0061H01L51/0071H05B33/14C07C2103/94C09K2211/1011C09K2211/1014C09K2211/1022C09K2211/1029H01L51/0056H01L51/0058H01L51/0072H01L51/5012H01L51/5048H01L51/5088H01L51/5203
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Quick Facts
Patent No.
US 9,548,457
App. No.
14/950,613
Granted
Jan 17, 2017
Kind
B2
Abstract

It is an object of the present invention to provide a material having a high Tg and a wide energy gap. The present invention provides a spirofluorene derivative represented by General Formula 1. (In the formula, R 1 is any one of hydrogen, an alkyl group having 1 to 4 carbon atoms, or a group represented by General Formula 2. Each of R 2 and R 3 is either hydrogen or an alkyl group having 1 to 4 carbon atoms and may be identical or different. R 4 is an aryl group having 6 to 15 carbon atoms. Each of R 5 and R 6 is any one of hydrogen, an alkyl group having 1 to 4 carbon atoms, or an aryl group having 6 to 15 carbon atoms and may be identical or different.)

Claims (35)

1. A semiconductor device comprising:

an element comprising a material having a molecular weight 698,

wherein the material having the molecular weight 698 consists of a first part of a molecular weight 532 and a second part of a molecular weight 166, and

wherein the first part is bonded to the second part by a single bond.

2. The semiconductor device according to claim 1 , wherein the element is provided over a glass substrate.

3. The semiconductor device according to claim 1 , wherein the element is provided over an insulating film comprising silicon nitride.

4. The semiconductor device according to claim 1 , wherein the material having the molecular weight 698 is represented by Structural Formula 107,

5. The semiconductor device according to claim 2 , wherein the material having the molecular weight 698 is represented by Structural Formula 108,

6. A semiconductor device comprising:

an element comprising a first electrode, a second electrode over the first electrode, a layer comprising a material between the first electrode and the second electrode,

wherein the material has a molecular weight 698,

wherein the material consists of a first part of a molecular weight 532 and a second part of a molecular weight 166, and

wherein the first part is bonded to the second part by a single bond.

7. The semiconductor device according to claim 6 , wherein the element is provided over a glass substrate.

8. The semiconductor device according to claim 6 , wherein the element is provided over an insulating film comprising silicon nitride.

9. The semiconductor device according to claim 6 , wherein the first electrode is an anode and the second electrode is a cathode.

10. The semiconductor device according to claim 6 , wherein the first electrode comprises at least one of ITO and silver.

11. The semiconductor device according to claim 6 , wherein the second electrode comprises at least one of magnesium and silver.

12. The semiconductor device according to claim 6 , wherein the material is represented by Structural Formula 107,

13. The semiconductor device according to claim 6 , wherein the material is represented by Structural Formula 108,

14. A semiconductor device comprising:

a transistor over a substrate;

an element electrically connected to the transistor, the element comprising a first electrode, a second electrode over the first electrode, and a layer comprising a material interposed therebetween; and

wherein the material has a molecular weight 698,

wherein the material consists of a first part of a molecular weight 532 and a second part of a molecular weight 166, and

wherein the first part is bonded to the second part by a single bond.

15. The semiconductor device according to claim 14 , wherein the substrate is a glass substrate.

16. The semiconductor device according to claim 14 , wherein the transistor comprises a crystalline semiconductor film.

17. The semiconductor device according to claim 14 , wherein the transistor comprises a gate electrode comprising molybdenum.

18. The semiconductor device according to claim 14 , wherein the element is provided over an insulating film comprising silicon nitride.

19. The semiconductor device according to claim 14 , wherein the first electrode is an anode and the second electrode is a cathode.

20. The semiconductor device according to claim 14 , wherein the first electrode comprises at least one of ITO and silver.

21. The semiconductor device according to claim 14 , wherein the second electrode comprises at least one of magnesium and silver.

22. The semiconductor device according to claim 14 , wherein the material is represented by Structural Formula 107,

23. The semiconductor device according to claim 14 , wherein the material is represented by Structural Formula 108,

Priority Claims (1)
JP 2005-289418 · Sep 30, 2005 · national
Continuity (5)
Division 14244432 · Apr 3, 2014
Division 13035256 · Feb 25, 2011
Continuation 12794145 · Jun 4, 2010
Division 11526874 · Sep 26, 2006
Related Publication 20160087209A1 · Mar 24, 2016