Electrical package including bimetal lid
Electrical package including bimetal lid. The electrical package includes: an organic substrate; a semiconductor chip electrically connected to electrical pads on a surface of the organic substrate via a plurality of solder balls; and a lid for encapsulating the semiconductor chip on the organic substrate, wherein (i) an inner surface of a central part of the lid is connected to a surface of the semiconductor chip via a first TIM, (ii) an inner surface of an outer part of the lid is hermetically connected to the surface of the organic substrate, and (iii) the lid has a bimetal structure including at least two different metals. A circuit module is also provided.
1. An electrical package, comprising:
an organic substrate;
a semiconductor chip electrically connected to electrical pads on a surface of the organic substrate via a plurality of solder balls; and
a three-layer lid for encapsulating the semiconductor chip on the organic substrate having a first Copper (Cu) metal layer, a second Copper (Cu) metal layer and a Copper alloy metal layer, wherein the Copper alloy metal is selected from a group consisting of: Chromium Copper (CuCr), Zirconium Copper (ZrCu), and a combination thereof; and wherein the Copper alloy metal layer is sandwiched by the first Copper metal layer and the second Copper metal layer; and
a cooling module formed on the three-layer lid via a second TIM that is thicker than the first TIM;
wherein:
(i) an inner surface of a central part of the first Copper metal layer of the lid is connected to a surface of the semiconductor chip via a first thermal interface material (TIM), wherein the first TIM is not the first Copper metal layer, the Copper alloy metal layer or the second Copper metal layer;
(ii) an inner surface of an outer part of the second Copper metal layer of the lid is hermetically connected to the surface of the organic substrate; and
(iii) the first copper layer and the second copper layer are the same length and width and cover the same area.
2. The electrical package according to claim 1 , wherein the cooling module comprises a heat sink.
3. The electrical package according to claim 1 , wherein the first and the second TIM comprise silicon or polymer resin containing conductive fillers.
4. The electrical package according to claim 1 , further comprising: an underfill formed between the semiconductor chip and the surface of the organic substrate.
5. The electrical package according to claim 1 , wherein the inner surface of the outer part of the second metal layer of the three-layer lid is hermetically connected to the surface of the organic substrate using sealing materials.
6. The electrical package according to claim 1 , wherein the organic substrate comprises a core layer sandwiched by two buildup layers.
7. The electrical package according to claim 6 , wherein the core layer comprises organic materials and a plurality of conductive vias to electrically connect between the two buildup layers.
8. The electrical package according to claim 7 , wherein the buildup layers comprise a plurality of wiring layers and dielectric layers.