Power transistor
A power transistor includes a number of transistor cells. Each transistor cell includes a source region, a drain region, a body region and a gate electrode. Each source region is arranged in a first semiconductor fin of a semiconductor body. Each drain region is at least partially arranged in a second semiconductor fin of the semiconductor body. The second semiconductor fin is spaced from the first semiconductor fin in a first horizontal direction of the semiconductor body. Each gate electrode is arranged in a trench adjacent the first semiconductor fin, is adjacent the body region, and is dielectrically insulated from the body region by a gate dielectric. Each of the first and second semiconductor fins has a width in the first horizontal direction and a length in a second horizontal direction, wherein the length is larger than the width.
1. A power transistor comprising:
a semiconductor body comprising a plurality of semiconductor fins that are spaced in a first lateral direction of the semiconductor body, and a semiconductor layer adjoining the semiconductor fins in a vertical direction of the semiconductor body, wherein the plurality of semiconductor fins comprises a first group of first semiconductor fins and a second group of second semiconductor fins, wherein a width of the second semiconductor fins of the second group is larger than a width of the first semiconductor fins of the first group;
a plurality of source regions, wherein each first semiconductor fin of the first group includes one of the plurality of source regions;
a plurality of drain regions, wherein each second semiconductor fin of the second group includes one of the plurality of drain regions;
a plurality of body regions, wherein each body region is arranged between one of the plurality of source regions and one of the plurality of drain regions;
a plurality of gate electrodes, wherein each gate electrode is arranged in a corresponding trench adjacent one of the first group of first semiconductor fins, is adjacent one of the plurality of body regions, and is dielectrically insulated from the one of the plurality of body regions by a gate dielectric;
a source node electrically coupled to each of the source regions;
a drain node electrically coupled to each of the drain regions; and
a gate node electrically coupled to each of the gate electrodes.
2. The power transistor of claim 1 , wherein each of the plurality of body regions is arranged in the semiconductor layer.
3. The power transistor of claim 1 , wherein each of the plurality of body regions is arranged in one of the first group of first semiconductor fins.
4. The power transistor of claim 1 , wherein at least one of the drain regions comprises a first section coupled to the drain node and a second section lower doped than the first section and adjoining one of the plurality of body regions.
5. The power transistor of claim 4 , wherein the first section and the second section have the same doping type.
6. The power transistor of claim 4 , wherein the first section has a doping type that is complementary to a doping type of the second section.
7. The power transistor of claim 1 , wherein at least one of the source regions comprises a first section coupled to the source node and a second section adjoining one of the plurality of body regions.
8. The power transistor of claim 7 , wherein the second section of the source region comprises a monocrystalline semiconductor material, and wherein the first section of the source region comprises a material selected from the group consisting of:
a monocrystalline semiconductor material doped higher than the second section of the source region;
a polycrystalline semiconductor material doped higher than the second section of the source region;
a metal alloy; and
a metal-semiconductor compound.
9. The power transistor of claim 1 , wherein the plurality of body regions have one of a doping type that is complementary to a doping type of the plurality of source regions, and a doping type corresponding to the doping type of the plurality of source regions.
10. The power transistor of claim 1 , wherein each of the plurality of drain regions is partially arranged in the semiconductor layer.
11. The power transistor of claim 1 ,
wherein each of the plurality of semiconductor fins comprise a width in the first lateral direction of the semiconductor body, and a length in a second horizontal direction substantially perpendicular to the first lateral direction; and
wherein the length is larger than the width.
12. The power transistor of claim 11 , wherein a ratio between the length and the width is at least 100:1.
13. The power transistor of claim 1 , wherein a number of the plurality of semiconductor fins is at least 100.
14. The power transistor of claim 1 , wherein the first semiconductor fins of the first group and the second semiconductor fins of the second group are arranged alternately in the first lateral direction.
15. A power transistor comprising a plurality of transistor cells, wherein each of the plurality of transistor cells comprises:
a source region arranged in a first semiconductor fin of a semiconductor body;
a drain region at least partially arranged in a second semiconductor fin of the semiconductor body, wherein the second semiconductor fin is spaced from the first semiconductor fin in a first horizontal direction of the semiconductor body, wherein
two of the plurality of transistor cells share one first semiconductor fin, and
two of the plurality of transistor cells share one second semiconductor fin;
a body region arranged between the source region and the drain region; and
a gate electrode, wherein the gate electrode is arranged in a trench adjacent the first semiconductor fin, is adjacent the body region, and is dielectrically insulated from the body region by a gate dielectric;
wherein each of the first and second semiconductor fins has a width in the first horizontal direction and a length in a second horizontal direction, wherein the length is larger than the width.
16. The power transistor of claim 15 , further comprising:
a source terminal, a drain terminal, and a gate terminal,
wherein the source region of each of the plurality of transistor cells is coupled to the source terminal,
wherein the drain region of each of the plurality of transistor cells is coupled to the drain terminal, and
wherein the gate electrode of each of the plurality of transistor cells is coupled to the gate terminal.
17. The power transistor of claim 15 , further comprising:
a semiconductor layer adjoining the first semiconductor fin and the second semiconductor fin in a vertical direction of the semiconductor body;
wherein the body region is arranged in the semiconductor layer.
18. The power transistor of claim 15 , wherein the body region is arranged in the first semiconductor fin.
19. The power transistor of claim 15 ,
wherein the drain region comprises a first section, and a second section; and
wherein the second section is lower doped than the first section and adjoins the body region.
20. The power transistor of claim 19 , wherein the first section and the second section have the same doping type.
21. The power transistor of claim 19 , wherein the first section has a doping type that is complementary to a doping type of the second section.
22. The power transistor of claim 15 , wherein the body region has one of a doping type that is complementary to a doping type of the source region, and a doping type corresponding to the doping type of the source region.
23. The power transistor of claim 15 ,
wherein the first semiconductor fin and the second semiconductor fin each comprises a width in the first horizontal direction of the semiconductor body, and a length in a second horizontal direction substantially perpendicular to the first horizontal direction; and
wherein the length is larger than the width.
24. The power transistor of claim 23 , wherein a width of the second semiconductor fin is larger than a width of the first semiconductor fin.
25. The power transistor of claim 24 , wherein a ratio between the length and the width is at least 100:1.
26. The power transistor of claim 15 , wherein a number of the transistor cells is at least 100.
27. The power transistor of claim 15 , further comprising:
a semiconductor layer adjoining the first semiconductor fin and the second semiconductor fin in a vertical direction of the semiconductor body,
wherein the drain region is partially arranged in the semiconductor layer.
28. A power transistor comprising a plurality of transistor cells, wherein each of the plurality of transistor cells comprises:
a source region arranged in a first semiconductor fin of a semiconductor body;
a drain region at least partially arranged in a second semiconductor fin of the semiconductor body, wherein the second semiconductor fin is spaced from the first semiconductor fin in a first horizontal direction of the semiconductor body;
a body region arranged between the source region and the drain region; and
a gate electrode, wherein the gate electrode is arranged in a trench adjacent the first semiconductor fin, is adjacent the body region, and is dielectrically insulated from the body region by a gate dielectric;
wherein each of the first and second semiconductor fins has a width in the first horizontal direction and a length in a second horizontal direction, wherein the length is larger than the width
wherein a width of the second semiconductor fin is larger than a width of the first semiconductor fin.
29. The power transistor of claim 28 , further comprising:
a source terminal, a drain terminal, and a gate terminal,
wherein the source region of each of the plurality of transistor cells is coupled to the source terminal,
wherein the drain region of each of the plurality of transistor cells is coupled to the drain terminal, and
wherein the gate electrode of each of the plurality of transistor cells is coupled to the gate terminal.
30. The power transistor of claim 28 , further comprising:
a semiconductor layer adjoining the first semiconductor fin and the second semiconductor fin in a vertical direction of the semiconductor body;
wherein the body region is arranged in the semiconductor layer.
31. The power transistor of claim 28 , wherein the body region is arranged in the first semiconductor fin.