Semiconductor structure and manufacturing method thereof
View Patent ↗A semiconductor structure includes a semiconductor substrate, at least a semiconductor layer formed on the semiconductor substrate, and at least a fin structure formed on the semiconductor layer. The semiconductor substrate includes a first semiconductor material, the semiconductor layer includes the first semiconductor material and a second semiconductor material, and the fin structure includes at least the first semiconductor material. A lattice constant of the second semiconductor material is different from a lattice constant of the first semiconductor material. The semiconductor layer includes a first width, the fin structure includes a second width, and the second width is smaller than the first width.
1. A semiconductor structure comprising:
a semiconductor substrate comprising a first semiconductor material;
at least a semiconductor layer formed on the semiconductor substrate, the semiconductor layer comprising the first semiconductor material and a second semiconductor material, a lattice constant of the second semiconductor material being different from a lattice constant of the first semiconductor material, and the semiconductor layer comprising a first width;
a dielectric structure formed on the semiconductor substrate, and the dielectric structure comprising a recess formed therein, wherein a bottom corner of the dielectric structure is encompassed by the semiconductor layer, and the first width of the semiconductor layer is larger than a width of the recess; and
at least a fin formed on the semiconductor layer, the fin comprising at least the first semiconductor material, the fin comprising a second width, and the second width of the fin being smaller than the first width of the semiconductor layer.
2. The semiconductor structure according to claim 1 , wherein the lattice constant of the second semiconductor material is larger than the constant of the first semiconductor material.
3. The semiconductor structure according to claim 1 , wherein the fin further comprises the second semiconductor material.
4. The semiconductor structure according to claim 3 , wherein a concentration of the second semiconductor material in the fin is between 20% and 80%.
5. The semiconductor structure according to claim 1 , wherein the semiconductor layer is formed on a bottom of the recess.
6. The semiconductor structure according to claim 5 , wherein a bottom of the semiconductor layer is lower than a surface of the semiconductor substrate, and the bottom of the semiconductor layer is lower than a bottom of the dielectric structure.
7. The semiconductor structure according to claim 1 , wherein the fin is formed in the recess.
8. The semiconductor structure according to claim 7 , wherein a top surface of the fin is higher than a top surface of the dielectric structure.
9. The semiconductor structure according to claim 1 , further comprising a gate layer formed on the fin.