A-staged thermoplastic-polyimide (TPI) adhesive compound and method of use
A compound and method of use thereof consisting of an A-staged thermoplastic-polyimide (TPI) adhesive, a viscous uncured liquid of polyamic-acid polymer (PAA), the TPI precursor, synthesized and dissolved in a polar aprotic organic solvent, and including, as appropriate, combinations of particulate ceramic and/or metallic thermally conducting, electrically insulating, and thermally conducting, electrically conducting fillers for interface-bonding to create a robust joint between surfaces with conventional lamination processes that utilize relatively moderate temperatures and applied pressures.
1. The process of interface bonding of two surfaces forming a bondline, said process comprising in combination:
A. providing an adhesive solution comprising an A-staged uncured thermoplastic-polyimide (TPI), said thermoplastic polyimide having the characteristic of being insoluble in an organic solvent in the fully imidized, fully cured state, in the form of a viscous liquid solution containing in combination:
1. a quantity of polar aprotic organic solvent;
2. a quantity of TPI precursor polyamic-acid polymer (PAA) synthesized and dissolved in said solvent wherein said polyamic-acid polymer comprises a mixture of diamine and dianhydride monomers, and wherein
said diamine monomer is selected from the group consisting of 3,3′-diaminobenzophenone (3,3′-DABP), 3,4′-diaminobenzophenone (3,4′-DABP), 1,3-Bis (4-aminophenoxy) benzene (TPER), 3,4′-Oxydianiline (3,4′-ODA), 4,4′-Oxydianiline (4,4′-ODA), 4,4′-Methylene dianiline (4,4′-MDA), an aliphatic diamine, and a silicon-diamine; and wherein
said dianhydride monomer is selected from the group consisting of 3,3′,4,4′-Biphenyltetracarboxylic dianhydride (BPDA), 3,3′,4,4′-Benzophenone tetracarboxylic dianhydride (BTDA), 4,4′-Oxydiphthalic anhydride (ODPA), Pyromellitic dianhydride (PMDA), and 2,2′-Bis-(3,4-Dicarboxyphenyl) hexafluoropropane dianhydride (6FDA); and
3. a quantity of particulate filler,
B. applying said uncured solution to at least one of said surfaces;
C. applying pressure to said bondline in a selected amount of between 0 and 100 psi; and
D. applying heat to said bondline at a selected temperature of between 150 and 470° C., thereby converting said PAA to TPI, in situ, to form said bond.
2. The process of interface bonding of claim 1 wherein said particulate filler comprises a quantity of thermally conducting solid particulate filler in the amount of between 5 and 98% by weight.
3. The process of interface bonding of claim 1 wherein said particulate filler comprises a quantity of electrically conducting solid particulate filler in the amount of between 5 and 98% by weight.
4. The process of interface bonding of claim 1 wherein said particulate filler comprises a quantity of electrically insulating solid particulate filler in the amount of between 5 and 98% by weight.