Laminated ceramic electronic component
A laminated ceramic capacitor has a capacitor body of roughly a rectangular solid shape defined by the length, width, and height, as well as a concaved part formed at and along the edges of one side and the other side in the height direction. An external electrode has a base conductor layer whose height-direction wrap-around part is formed inside the concaved part, and a main conductor layer whose height-direction wrap-around part is formed continuously over the height-direction wrap-around part of the base conductor layer through the planar part, except for the concaved part, of one side and the other side of the component body in the height direction. The height-direction wrap-around part of the main conductor layer has a planar connecting area constituted by a surface area over the height-direction wrap-around part of the base conductor layer and a surface area over the planar part of the component body.
1. A laminated ceramic electronic component constituted by a component body of laminate structure and external electrodes provided thereon, wherein:
the component body has a shape of roughly a rectangular solid defined by a length, width, and height, with a concaved part formed at and along edges of a one side and other side in a height direction, said concaved part being constituted by a recess having a sidewall and a planar bottom continuously extending in a length direction from the edge of the one side, and another recess having a sidewall and a planar bottom continuously extending in the length direction from the edge of the other side;
the external electrodes each have a base conductor layer whose height-direction wrap-around part is formed inside the concaved part of the component body, and a main conductor layer whose height-direction wrap-around part is formed continuously over the height-direction wrap-around part of the base conductor layer through a planar part, except for the concaved part, of the one side and the other side of the component body in the height direction; and
the height-direction wrap-around part of the main conductor layer has a planar connecting area constituted by a first area over a surface of the height-direction wrap-around part of the base conductor layer and a second area, without overlapping the first area in the height direction, over a surface of the planar part of the component body, wherein the first area is shorter than the second area in the length direction, and a width of the first area is wider than a width of the second area.
2. A laminated ceramic electronic component according to claim 1 , wherein a supplemental conductor layer whose role is to supplement adhesion of the height-direction wrap-around part of the main conductor layer to the component body is present between the height-direction wrap-around part of the main conductor layer and the one side or the other side of the component body in the height direction.
3. A laminated ceramic electronic component according to claim 2 , wherein the concaved part is continuously formed over length-direction edges and width-direction edges of the one side and the other side of the component body in the height direction.
4. A laminated ceramic electronic component according to claim 2 , wherein the concaved part is formed only at and along length-direction edges of the one side and the other side of the component body in the height direction.
5. A laminated ceramic electronic component according to claim 2 , wherein the main conductor layer has a width-direction wrap-around part that continues to the height-direction wrap-around part, and a length of the width-direction wrap-around part of the main conductor layer is shorter than a length of the height-direction wrap-around part of the main conductor layer.
6. A laminated ceramic electronic component according to claim 5 , wherein, at the height-direction wrap-around part, a part longer than the width-direction wrap-around part continuously has a ridgeline covering part that covers a length-direction ridgeline of the component body.
7. A laminated ceramic electronic component according to claim 2 , wherein the main conductor layer has a width-direction wrap-around part that continues to the height-direction wrap-around part, and a length of the width-direction wrap-around part is equivalent to a length of the height-direction wrap-around part.
8. A laminated ceramic electronic component according to claim 1 , wherein the concaved part is continuously formed over length-direction edges and width-direction edges of the one side and the other side of the component body in the height direction.
9. A laminated ceramic electronic component according to claim 8 , wherein the main conductor layer has a width-direction wrap-around part that continues to the height-direction wrap-around part, and a length of the width-direction wrap-around part of the main conductor layer is shorter than a length of the height-direction wrap-around part of the main conductor layer.
10. A laminated ceramic electronic component according to claim 9 , wherein, at the height-direction wrap-around part, a part longer than the width-direction wrap-around part continuously has a ridgeline covering part that covers a length-direction ridgeline of the component body.
11. A laminated ceramic electronic component according to claim 8 , wherein the main conductor layer has a width-direction wrap-around part that continues to the height-direction wrap-around part, and a length of the width-direction wrap-around part is equivalent to a length of the height-direction wrap-around part.
12. A laminated ceramic electronic component according to claim 1 , wherein the concaved part is formed only at and along length-direction edges of the one side and the other side of the component body in the height direction.
13. A laminated ceramic electronic component according to claim 12 , wherein the main conductor layer has a width-direction wrap-around part that continues to the height-direction wrap-around part, and a length of the width-direction wrap-around part of the main conductor layer is shorter than a length of the height-direction wrap-around part of the main conductor layer.
14. A laminated ceramic electronic component according to claim 13 , wherein, at the height-direction wrap-around part, a part longer than the width-direction wrap-around part continuously has a ridgeline covering part that covers a length-direction ridgeline of the component body.
15. A laminated ceramic electronic component according to claim 12 , wherein the main conductor layer has a width-direction wrap-around part that continues to the height-direction wrap-around part, and a length of the width-direction wrap-around part is equivalent to a length of the height-direction wrap-around part.
16. A laminated ceramic electronic component according to claim 1 , wherein the main conductor layer has a width-direction wrap-around part that continues to the height-direction wrap-around part, and a length of the width-direction wrap-around part of the main conductor layer is shorter than a length of the height-direction wrap-around part of the main conductor layer.
17. A laminated ceramic electronic component according to claim 16 , wherein, at the height-direction wrap-around part, a part longer than the width-direction wrap-around part continuously has a ridgeline covering part that covers a length-direction ridgeline of the component body.
18. A laminated ceramic electronic component according to claim 1 , wherein the main conductor layer has a width-direction wrap-around part that continues to the height-direction wrap-around part, and a length of the width-direction wrap-around part is equivalent to a length of the height-direction wrap-around part.