IP Library Granted Patent US 9,990,971
Granted Patent B2
US 9,990,971 · App. 14/959,140 · Granted Jun 5, 2018

Devices, methods, and systems supporting on unit termination

Inventor: Terry M. Grunzke (Boise, ID)
Assignee: Micron Technology, Inc.
G11C7/22G06F13/1668G11C5/04G11C29/025G11C29/028Y02D10/14
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Quick Facts
Patent No.
US 9,990,971
App. No.
14/959,140
Granted
Jun 5, 2018
Kind
B2
Abstract

The present disclosure includes devices, methods, and systems supporting on unit termination. A number of embodiments include a number of memory units, wherein a memory unit includes termination circuitry, and a memory unit does not include termination circuitry.

Claims (50)

1. A system, comprising:

a number of memory devices, wherein each of the number of memory devices includes a number of memory units, wherein:

a memory unit of each respective memory device includes termination circuitry and a termination matrix, wherein:

the termination circuitry includes a number of different selectable resistors; and

the termination matrix includes a number of resistance values associated with the termination circuitry for a number of different input/output speeds, clock frequencies, and bus speeds associated with the number of memory devices, wherein each of the number of resistance values represents a different one of the number of input/output speeds, clock frequencies, and bus speeds associated with the number of memory devices; and

a memory unit of each respective memory device does not include termination circuitry.

2. The system of claim 1 , wherein the termination circuitry is configured to monitor commands provided across a bus of the number of memory devices.

3. The system of claim 1 , wherein the termination circuitry is configured to perform a termination function upon detection of a particular command provided across a bus of the number of memory devices.

4. The system of claim 3 , wherein the termination circuitry is configured to de-activate upon performing the termination function.

5. The system of claim 3 , wherein the system includes a controller configured to adjust a timing mode associated with the number of memory devices.

6. The system of claim 5 , wherein the memory unit of each respective memory device that includes the termination circuitry and the termination matrix is configured to adjust the termination circuitry based, at least partially, on the adjustment of the timing mode.

7. A method of operating a system, comprising:

adjusting a timing mode associated with a number of memory devices of the system, wherein:

each of the number of memory devices includes a number of memory units;

a memory unit of each respective memory device includes termination circuitry and a termination matrix, wherein the termination matrix includes a number of resistance values associated with the termination circuitry for a number of different input/output speeds, clock frequencies, and bus speeds associated with the number of memory devices, wherein each of the number of resistance values represents a different one of the number of input/output speeds, clock frequencies, and bus speeds associated with the number of memory devices; and

a memory unit of each respective memory device does not include termination circuitry;

adjusting the termination circuitry of the memory unit of at least one of the number of memory devices based, at least partially, on the adjustment of the timing mode;

monitoring, by the termination circuitry, commands provided across a bus of the number of memory devices;

activating, by the termination circuitry, upon detection of a particular command to perform a termination function; and

de-activating, by the termination circuitry, upon performing the termination function.

8. The method of claim 7 , wherein the method includes:

adjusting the timing mode using a controller of the system; and

adjusting the termination circuitry using the memory unit of the at least one of the number of memory devices.

9. The method of claim 7 , wherein adjusting the termination circuitry includes increasing or decreasing a resistance value associated with a number of selectable resistors of the termination circuitry.

10. The method of claim 9 , wherein increasing or decreasing the resistance value associated with the number of selectable resistors includes increasing or decreasing the resistance value to a minimum resistance value that permits the number of memory devices to operate at an input/output speed of the adjusted timing mode.

11. The method of claim 7 , wherein adjusting the termination circuitry includes turning the termination circuitry off.

12. The method of claim 7 , wherein adjusting the timing mode includes adjusting an input/output speed associated with the number of memory devices.

13. The method of claim 7 , wherein adjusting the timing mode includes adjusting a clock frequency associated with the number of memory devices.

14. The method of claim 7 , wherein adjusting the timing mode includes adjusting a bus speed associated with the bus of the number of memory devices.

15. A system, comprising:

a number of memory devices, wherein each of the number of memory devices includes a number of memory units, wherein:

a memory unit of each respective memory device includes termination circuitry and a termination matrix, wherein:

the termination circuitry includes a number of different selectable resistors;

the termination matrix includes a number of resistance values associated with the termination circuitry for a number of different input/output speeds, clock frequencies, and bus speeds associated with the number of memory devices, wherein each of the number of resistance values represents a different one of the number of input/output speeds, clock frequencies, and bus speeds associated with the number of memory devices; and

the termination circuitry is configured to:

monitor commands provided across a bus of the number of memory devices;

activate upon detection of a particular command to perform a termination function; and

de-activate upon performing the termination function; and

a memory unit of each respective memory device does not include termination circuitry.

16. The system of claim 15 , wherein the system includes a controller coupled to the number of memory devices, wherein the controller is configured to control access across a number of memory channels coupled to the respective number of memory devices via the bus.

17. The system of claim 15 , wherein only one or only two memory units of each respective memory device include the termination circuitry and the termination matrix.

18. The system of claim 15 , wherein:

the memory unit of each respective memory device that includes the termination circuitry and the termination matrix is configured to provide electrostatic discharge protection for the memory unit of that respective memory device that does not include termination circuitry; and

the memory unit of each respective memory device that does not include termination circuitry is configured to provide electrostatic discharge protection for the memory unit of that respective memory device that does not include termination circuitry.

19. The system of claim 15 , wherein:

the memory unit of each respective memory device includes the termination circuitry and a termination matrix is a die; and

the termination circuitry is on die termination circuitry.

20. The system of claim 15 , wherein:

only one memory unit of each respective memory device includes the termination circuitry and the termination matrix; and

a plurality of memory units of each respective memory device does not include termination circuitry.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 4, 2015
From: GRUNZKE, TERRY M.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 037209/0934 →
Continuity (2)
Continuation 13192125 · Jul 27, 2011
Related Publication 20160093348A1 · Mar 31, 2016