Composition for film formation, resist underlayer film and forming method thereof, pattern-forming method and compound

1. A pattern-forming method comprising:

applying a composition on an upper face side of a substrate to form a resist underlayer film;

baking the resist underlayer film;

forming a resist pattern on an upper face side of the resist underlayer film; and

sequentially etching the resist underlayer film and a substrate using the resist pattern as a mask,

wherein the composition comprises:

a compound represented by formula (1); and

a solvent,

wherein in the formula (1),

R 1 , R 2 and R 3 each independently represent a group represented by formula (a), wherein R 1 , R 2 and R 3 are identical or different;

R a , R b , R c and R d each independently represent a halogen atom, a hydroxy group, an amino group, a sulfanyl group, or a monovalent organic group having 1 to 20 carbon atoms and not comprising an aromatic ring;

x, y and z are each independently an integer of 0 to 4; and

w is an integer of 0 to 3,

wherein in a case where R a to R d are each present in a plurality of number, a plurality of R a s are identical or different, a plurality of R b s are identical or different, a plurality of R c s are identical or different, and a plurality of R d s are identical or different,

R A —C≡C—R B —  (a)

wherein in the formula (a),

R A represents a hydrogen atom, an aryl group, or an alkyl group unsubstituted or substituted with at least one of a hydroxy group and an aryl group; and

R B represents a single bond or an arylene group,

wherein a part or all of hydrogen atoms on an aromatic ring of the aryl group and the arylene group are unsubstituted or substituted with a halogen atom, a hydroxy group, an amino group, a sulfanyl group, or a monovalent organic group having 1 to 20 carbon atoms and not comprising an aromatic ring.

2. The pattern-forming method according to claim 1 , wherein the forming of the resist pattern comprises forming an intermediate layer on the upper face side of the resist underlayer film, and forming the resist pattern on an upper face side of the intermediate layer, and

the etching further comprises etching the intermediate layer.

3. The pattern-forming method according to claim 1 , wherein a molecular weight of the compound is no less than 400 and no greater than 1,000.

4. The pattern-forming method according to claim 1 , wherein the composition further comprises a crosslinking agent.

5. The pattern-forming method according to claim 1 , wherein a carbon percentage content of the compound is no less than 50 atom %.

6. The pattern-forming method according to claim 1 , wherein in the formula (a), R A represents a hydrogen atom, an aryl group, or an alkyl group unsubstituted or substituted with an aryl group.

7. The pattern-forming method according to claim 1 , wherein in the formula (a), at least one R A represents a hydrogen atom.

8. The pattern-forming method according to claim 1 , wherein in the formula (a), at least two R A s represent a hydrogen atom.

9. The pattern-forming method according to claim 1 , wherein in the formula (a), R A represents a hydrogen atom.

10. The pattern-forming method according to claim 1 , wherein a content of the compound in the composition is no less than 80% by mass with respect to a total solid content of the composition.

11. The pattern-forming method according to claim 1 , wherein a content of the compound in the composition is no less than 90% by mass with respect to a total solid content of the composition.

12. The pattern-forming method according to claim 1 , wherein a content of the compound in the composition is no less than 95% by mass with respect to a total solid content of the composition.