Methods of forming transfer films
Methods of making transfer films to form bridged nanostructures are disclosed. The methods include applying a thermally stable backfill layer to a structured surface of a sacrificial template layer.
1. A method of forming a transfer film, comprising:
applying a thermally stable backfill layer to a structured surface of a sacrificial template layer, the thermally stable backfill layer conforms to the structured surface of the sacrificial template layer and comprises thermally stable molecular species; and
allowing a portion of the thermally stable molecular species to migrate into the sacrificial template layer to form the transfer film.
2. The method according to claim 1 , wherein the allowing step forms a gradient of thermally stable molecular species within the sacrificial template layer and the gradient comprises a concentration of thermally stable molecular species that increases as a function of a distance from the structured surface.
3. The method according to claim 1 , wherein the sacrificial template layer is cleanly baked out leaving a bridging layer disposed on the structured surface and defining engineered voids.
4. The method according to claim 1 , wherein the thermally stable molecular species comprises a metal or metal oxide or metal oxide precursor.
5. The method according to claim 1 , wherein the thermally stable molecular species comprises an organosilicon polymer.
6. The method according to claim 4 , wherein the sacrificial template layer comprises a (meth)acrylic polymer.
7. The method according to claim 6 , wherein the (meth)acrylic polymer comprises a majority of polyether segments or a majority of ethoxylated segments.