ELECTRONIC PACKAGE THAT INCLUDES MULTIPLE SUPPORTS
An electronic package that includes a substrate; a die attached to the substrate; an underfill positioned between the die and the substrate due to capillary action; a first support adjacent to the die and attached to the substrate; and a second support mounted on the first support, wherein the second support is closer to the die than the first support, wherein first support surrounds the die and the second support surrounds the die, and wherein the second support is a different material than the first support. The die may be flip chip bonded to the substrate and the underfill may secure the die to the substrate. The first support may be attached to the substrate using an adhesive and the second support may be attached to the first support using an adhesive.
1 . An electronic package comprising:
a substrate;
a die attached to the substrate;
an underfill positioned between the die and the substrate;
a first support adjacent to the die and attached to the substrate; and
a second support mounted on the first support, wherein the first support is magnetically bonded to the second support.
2 . The electronic package of claim 1 , wherein the die is flip chip bonded to the substrate.
3 . The electronic package of claim 1 , wherein the underfill secures the die to the substrate.
4 . The electronic package of claim 1 , wherein first support is attached to the substrate using an adhesive.
5 . (canceled)
6 . The electronic package of claim 1 , wherein the first support is a different material than the second support.
7 . The electronic package of claim 1 , wherein first support surrounds the die.
8 . The electronic package of claim 7 , wherein the second support surrounds the die.
9 - 10 . (canceled)
11 . The electronic package of claim 1 , wherein the second support is thicker than the first support.
12 . (canceled)
13 . An electronic package comprising:
a substrate;
a die attached to the substrate;
an underfill positioned between the die and the substrate;
a first support adjacent to the die and attached to the substrate; and
a second support mounted on the first support, wherein the second support is a different material than the first support, wherein first support completely surrounds sidewalls of the die, and wherein the second support completely surrounds the sidewalls of the die.
14 . The electronic package of claim 13 , wherein the die is flip chip bonded to the substrate, wherein the underfill secures the die to the substrate, and wherein first support is attached to the substrate using an adhesive.
15 . (canceled)
16 . The electronic package of claim 13 , wherein the second support is thicker than the first support.
17 . An electronic package comprising:
a substrate;
a die attached to the substrate;
an underfill positioned between the die and the substrate;
a first support adjacent to the die and attached to the substrate; and
a second support mounted on the first support such that the second support is in direct physical contact with the first support, and wherein the second support is a different material than the first support, wherein the first support is metal and the second support is a different metal.
18 . The electronic package of claim 17 , wherein the die is flip chip bonded to the substrate, and wherein the underfill secures the die to the substrate.
19 . (canceled)
20 . The electronic package of claim 17 , wherein the second support is thicker than the first support.
21 . The electronic package of claim 7 , wherein the first support is stainless steel and the second support is a different stainless steel.