Uniform height tall fins with varying silicon germanium concentrations
View Patent ↗A method of making a semiconductor device includes forming a first fin in a first semiconducting material layer disposed over a substrate, the first semiconducting material layer comprising an element in a first concentration; and forming a second fin in a second semiconducting material layer disposed over the substrate and adjacent to the first semiconducting material layer, the second semiconducting material layer comprising the element in a second concentration; wherein the first concentration is different than the second concentration.
1. A method of making a semiconductor device, the method comprising:
etching trenches in a semiconducting material disposed over a substrate to form a first active area and a second active area in the semiconducting material, the first active area being adjacent to the second active area;
recessing the semiconducting material of the first active area and the second active area to different depths;
growing a first epitaxial layer over the semiconducting material of the first active area and a second epitaxial layer over the semiconducting material of the second active area, the first epitaxial layer and the second epitaxial layer comprising a common element;
performing a thermal mixing process to merge the first epitaxial layer with the semiconducting material of the first active area, distribute the common element of the first epitaxial layer within the semiconducting material of the first active area, and form a first merged active area comprising the first epitaxial layer and the semiconducting material of the first active area; and to merge the second epitaxial layer with the semiconducting material of the second active area, distribute the common element of the second epitaxial layer within the semiconducting material of the second active area, and form a second merged active area comprising the second epitaxial layer and the semiconducting material of the second active area, the first merged active area and the second merged active area comprising the common element in different concentrations;
forming a first fin in the first merged active area; and
forming a second fin in the second merged active area.
2. The method of claim 1 , further comprising planarizing the first epitaxial layer and the second epitaxial layer after growing the first epitaxial layer and the second epitaxial layer.
3. The method of claim 1 , further comprising disposing a hard mask layer over the over the first epitaxial layer and the second epitaxial layer before performing the thermal mixing process.
4. The method of claim 3 , further comprising removing the hard mask layer before forming the first fin and the second fin.
5. The method of claim 1 , wherein the common element is germanium, silicon, or a combination thereof.
6. The method of claim 1 , wherein the first fin and the second fin have substantially the same height.