Semiconductor memory device
View Patent ↗In this semiconductor memory device, the first conducting layers are arrayed laminated in a first direction, and extend in a second direction intersecting with the first direction. The first conducting layers are arrayed in a third direction via interlayer insulating films. The third direction intersects with the first direction and the second direction. The interlayer insulating film is disposed between the first conducting layers arrayed in the third direction, and extends in the first direction. The second conducting layer is disposed between the first conducting layers arrayed in the third direction, and extends in the first direction. The second conducting layer has an approximately circular cross-sectional shape intersecting with the first direction. The variable resistance layer surrounds a peripheral area of the second conducting layer, and is disposed at a position between the second conducting layer and the first conducting layer.
1. A semiconductor memory device, comprising:
a plurality of first conducting layers stacked in a first direction, the first conducting layers extending in a second direction intersecting with the first direction, the first conducting layers being arranged in a third direction, the third direction intersecting with the first direction and the second direction;
an interlayer insulating film disposed between the first conducting layers arranged in the third direction, the interlayer insulating film extending in the first direction;
a second conducting layer disposed between the first conducting layers arranged in the third direction, the second conducting layer extending in the first direction, the second conducting layer having an approximately circular cross-sectional shape intersecting with the first direction; and
a variable resistance layer that surrounds a peripheral area of the second conducting layer, the variable resistance layer being disposed at a position between the second conducting layer and the first conducting layer, wherein
a width of one of the first conducting layers in the third direction is wider than a distance between the first conducting layers adjacent in the third direction,
a width of an outer shape of the variable resistance layer that surrounds the peripheral area of the second conducting layer, in the third direction is wider than the distance between the first conducting layers adjacent in the third direction, and
a width of the first conducting layer in the third direction where the first conducting layer is adjacent to the variable resistance layer in the third direction is narrower than a width of the first conducting layer in the third direction where the first conducting layer is not adjacent to the variable resistance layer in the third direction.
2. The semiconductor memory device according to claim 1 , wherein
a plurality of the second conducting layers are disposed along the second direction,
the interlayer insulating film is disposed between the second conducting layers, and
the variable resistance layers adjacent in the second direction are disconnected at a position of the interlayer insulating film.
3. The semiconductor memory device according to claim 2 , wherein
the variable resistance layer is disposed at a position between the second conducting layer and the interlayer insulating film.
4. The semiconductor memory device according to claim 1 , wherein
a width of the interlayer insulating film in the third direction is smaller than a width of an outer shape of the variable resistance layer in the third direction, the variable resistance layer being disposed around the second conducting layer.
5. The semiconductor memory device according to claim 4 , wherein
the second conducting layer and the variable resistance layer are disposed at positions of separating the interlayer insulating film in the second direction, the variable resistance layer covering the peripheral area of the second conducting layer.
6. The semiconductor memory device according to claim 5 , wherein
a plurality of the second conducting layers adjacent in the third direction are positioned different from one another in the second direction.
7. The semiconductor memory device according to claim 1 , further comprising
a selection transistor connected to one end of the second conducting layer, wherein the selection transistor includes:
a semiconductor layer connected to the one end of the second conducting layer, the semiconductor layer extending in the first direction; and
a third conducting layer covering a peripheral area of the semiconductor layer via a gate insulating film.
8. The semiconductor memory device according to claim 7 , further comprising
a fourth conducting layer connected to the second conducting layer via the selection transistor, the fourth conducting layer extending in the third direction, wherein
the semiconductor layer has a center position positioned displaced in the second direction with respect to a center of the fourth conducting layer.
9. The semiconductor memory device according to claim 8 , further comprising
a plurality of the selection transistors connected to ends of the second conducting layers disposed along the third direction, wherein
the semiconductor layers adjacent in the third direction are disposed at positions displaced in different directions from one another with respect to the center of the fourth conducting layer.
10. A semiconductor memory device, comprising:
a plurality of first conducting layers stacked in a first direction, the first conducting layers extending in a second direction intersecting with the first direction, the first conducting layers being arranged in a third direction, the third direction intersecting with the first direction and the second direction;
an interlayer insulating film disposed between the first conducting layers arranged in the third direction, the interlayer insulating film extending in the first direction;
a columnar-shaped second conducting layer disposed between the first conducting layers arranged in the third direction, the second conducting layer extending in the first direction; and
a variable resistance layer that surrounds a peripheral area of the second conducting layer, the variable resistance layer being disposed at a position between the second conducting layer and the first conducting layer, wherein
the second conducting layer and the variable resistance layer are disposed between the first conducting layers arranged in the third direction,
the second conducting layer and the variable resistance layer are disposed at a position of separating the interlayer insulating film in the second direction,
a width of one of the first conducting layers in the third direction is wider than a distance between the first conducting layers adjacent in the third direction,
a width of an outer shape of the variable resistance layer that surrounds the peripheral area of the second conducting layer, in the third direction is wider than the distance between the first conducting layers adjacent in the third direction, and
a width of the first conducting layer in the third direction where the first conducting layer is adjacent to the variable resistance layer in the third direction is narrower than a width of the first conducting layer in the third direction where the first conducting layer is not adjacent to the variable resistance layer in the third direction.
11. The semiconductor memory device according to claim 10 , wherein
the variable resistance layer is disposed around the second conducting layers, a width of an outer shape of the variable resistance layer in the third direction being larger than a width of the interlayer insulating film in the third direction.
12. The semiconductor memory device according to claim 10 , wherein
a plurality of the second conducting layers are disposed along the second direction,
the interlayer insulating film is disposed between the second conducting layers, and
the variable resistance layer being disconnected at a position of the interlayer insulating film in the second direction.
13. The semiconductor memory device according to claim 12 , wherein
the variable resistance layer is disposed at a position between the second conducting layer and the interlayer insulating film.
14. The semiconductor memory device according to claim 10 , wherein
a plurality of the second conducting layers adjacent in the third direction are positioned different from one another in the second direction.
15. The semiconductor memory device according to claim 10 , further comprising
a selection transistor connected to one end of the second conducting layer, wherein the selection transistor includes:
a semiconductor layer connected to the one end of the second conducting layer, the semiconductor layer extending in the first direction; and
a third conducting layer covering a peripheral area of the semiconductor layer via a gate insulating film.
16. The semiconductor memory device according to claim 15 , further comprising a fourth conducting layer connected to the second conducting layer via the selection transistor, the fourth conducting layer extending in the third direction, wherein
the semiconductor layer has a center position positioned displaced in the second direction with respect to a center of the fourth conducting layer.
17. The semiconductor memory device according to claim 16 , wherein
the semiconductor layers adjacent in the third direction are disposed at positions displaced in different directions from one another with respect to the center of the fourth conducting layer.
18. The semiconductor memory device according to claim 10 , wherein
the second conducting layer and the variable resistance layer that surrounds the peripheral area of the second conducting layer have an approximately circular cross-sectional shape along the second direction and the third direction.